Philips Advanced Metrology Systems, Inc. (Philips AMS) today announced that it has integrated new advanced process automation software into its 3000 platform of metrology tools. The new software will enable semiconductor manufacturers to implement Philips AMS' 300mm metrology tools into an automated, high-volume wafer fab faster with less integration time. The PEER Group Inc., Philips' equipment automation and data management technology partner, implemented its PEER Tool Orchestrator (PTOTM) automation backbone along with Asyst's ConX300 connectivity application for use in Philips AMS Series 3000 and the new IR3000. Customers around the globe are currently using the new software in their fully automated manufacturing lines.
The successful implementation of APC requires the acquisition and processing of large amounts of data in real time. To generate this amount of data, device manufacturers need to implement high-throughput metrology solutions that can measure, analyze and forward large amounts of data in real time for use in process adjustments. One of the challenges has been integrating new manufacturing equipment with fully automated OHT transport fabs. The new Philips AMS software ensures that its metrology tools will be able to effectively interact with a customer's fully automated host system while providing the fast, reliable measurements needed for APC.
“As the industry becomes more automated and focused on improving yield, the need for scalable software integration becomes imperative,” said Bill Gately, general manager of Philips AMS. “Our customers are very excited about the new software as it will allow them to better integrate metrology into their APC strategies and improve the automation of their 300mm fabs. Both our Series3000 and IR3000 customers have already seen significant benefits in their use of the software including fabs with E84-compliant overhead transport system integration. The new E95-based software has resulted in significantly faster system integration times and overall lower COO.”
“By partnering with Philips AMS from early in tool design, we were able to leverage our PTO automation software and expertise with Philips AMS's core competence in metrology and analysis,” said Robert Harris, president of PEER Group. “The result is equipment with superior performance in both semiconductor processing and automated manufacturing.”
The new software is available on Philips AMS' 3000 Platform suitable for high-volume manufacturing applications on patterned wafers and incorporates either the Philips AMS SurfaceWave™ technology or an infrared (MBIR) technology. SurfaceWave, used in the Series 3300, is a non-contact, laser-based technique that provides rapid measurement of thickness on blanket and patterned metal films, providing timely information for the control of copper-based processes. The Model Based InfraRed (MBIR) reflectance technology uses a model-based IR (MBIR) measurement for the thickness and uniformity of dielectric layers and structures used in IC manufacturing.
PEER Group provides leading-edge factory automation software solutions and consulting services to advanced manufacturers and OEMs in the semiconductor, electronics, life sciences and automotive industries. Many of the world's best manufacturing companies turn to PEER Group to solve their most challenging equipment automation, data management and custom application development problems. PEER Group partners with leading software and automation companies to assure the most efficient delivery of highly functional, reliable and scalable solutions.
Bill Schmalz, Global OEM Sales Manager bill.schmalz@peergroup.com 1 519-749-9554
C.J.L Moore, Philips AMS cjl.moore@philips.com (508) 647-1145
© 2005 The PEER Group Inc