Archived events

11/28/2018: SEMI Smart Manufacturing Workshop - Session Leader, Presenter, Sponsor

SEMI Smart Manufacturing Workshop - Session Leader, Presenter, Sponsor

November 28, 2018 | SEMI International Headquarters | Milpitas, CA

Join SEMI’s Smart Manufacturing Technology Community at this one-day workshop to discuss real-world use cases for Smart Manufacturing and how you can leverage it for better business results.

Doug Suerich

Doug Suerich will lead the Security breakout session – Access Data/Data Sharing, Data Policies – which will look at:

  • Data management and policies for the different types, classes and levels of data generated in a Smart Manufacturing environment
  • Data access and transfer protocols
  • Existing and needed standards to raise security “comfort levels”

Doug will also present the latest IMA APC Council meeting results.

Click here to register for the workshop: https://bit.ly/2AoggEE

11/13/2018: SEMICON Europa - Booth A4445, A4

SEMICON Europa - Booth A4445, A4

November 13-16, 2018 | Messe München | Munich, Germany

Mike Barrett

"Helping OEMs scale up to big data volumes"

Mike Barrett, Director, Global OEM Sales
TechLOUNGE Hall A4
Wednesday, November 14, 2018
12:00

The market is demanding faster throughput, smaller feature sizes and higher quality. Data is the fuel that drives these improvements – from more sensors to faster sampling and greater integration of different sources. Collecting larger data volumes allows for deeper insight into critical process and production metrics and provides the possibility of using advanced analytics and machine learning to speed defect analysis and reduce repair times. However, this explosion of big data can overwhelm traditional data sharing and storage mechanisms. Join us as we discuss cutting edge approaches to managing your data including new storage solutions, best practices for where your data should live and methods for sharing that data with your analysis systems and global experts.

Missed the presentation? Request the slides.




Michael Arnold

“Smart Manufacturing” 

Session Chair: Michael Arnold, Managing Director, PEER Group GmbH
TechARENA 1, Hall A4
Wednesday, November 14, 2018
11:45 - 13:50

http://www.semiconeuropa.org/show-floor-techarena#5




Doug Suerich

“Cybersecurity for factories and tools: protecting yourself against potential threats”

Doug Suerich, Product Evangelist
TechARENA 1, Hall A4
Wednesday, November 14, 2018
13:25

Highly-automated semiconductor manufacturing relies on machine-to-machine (M2M) and machine-to-host connectivity. But, this introduces a security risk for both equipment makers and factories. A virus on a single tool could cause costly factory-wide downtime. Forward-thinking OEMs are wondering whether they have protected their equipment adequately against potential cyber threats. Forward-thinking factories are considering all of the equipment on their manufacturing floors to ensure they stay risk free. This talk explores the need for OEMs to set up an ongoing equipment maintenance strategy that takes into consideration several important steps: upgrading all tools to modern-day operating systems that enable virus scanning, installing new connectivity software products to support new technologies and new factory requirements, and leveraging the secure remote connectivity to perform remote virus scans on all files moving into the factory, manage ongoing equipment maintenance activities to keep tools up to date, audit production tools to address software end of service (EOS) issues, and avoid causing factory-wide downtime by introducing a virus.

Missed the presentation? Request the slides.

10/08/2018: Advanced Process Control (APC) Conference - Presenter and Sponsor

Advanced Process Control (APC) Conference – Presenter and Sponsor

October 8-11, 2018 | Airport Hilton Hotel | Austin, TX

Doug Suerich

"Building the road to Smart Manufacturing"

Doug Suerich, Product Evangelist
Tuesday, October 9, 2018
4:30pm

The International Roadmap for Devices and Systems (IRDS) maintains a 15-year technology roadmap covering many areas, including Smart Manufacturing and Industry 4.0, for the devices and systems industries. This talk introduces work currently underway by some SEMI® task forces and technical committees to update the SEMI standards in an effort to enable the vision proposed by the IRDS roadmap and move the state of the industry forward.

Missed the presentation? Request the slides.




“Throughput optimization in sophisticated equipment”

Doug Suerich, Product Evangelist
Wednesday, October 10, 2018
11:30am

This talk presents a case study in which we investigated throughput optimization opportunities on a complex cluster tool and increased throughput by 13% using only software and configuration changes.

Missed the presentation? Request the slides.

09/05/2018: SEMICON Taiwan - Booth K2666, 1F

SEMICON Taiwan - Booth K2666, 1F

September 5-7, 2018 | Taipei Nangang Exhibition Center | Taipei, Taiwan

Mike Thiessen

“Speed the way to Smart Manufacturing with standards-compliant factory automation software”

Mike Thiessen, Product Engineering Manager
Wednesday, September 5, 4:45pm
Smart Manufacturing Forum, 5F

Industry 4.0 promises revolutionary improvements in quality, throughput and speed to market. To support next-generation manufacturing initiatives, factory automation software systems need to be fault-tolerant, fast and reliable. However, the initial investment for Smart Manufacturing can seem like a barrier. This talk highlights how companies can leverage existing SEMI® standards to capture best practices and build on the learnings of others, helping you lower costs and deliver projects on time.

Missed the presentation? Request the slides.




“Smart station controllers for Smart Manufacturing”

Mike Thiessen, Product Engineering Manager
Friday, September 7, 11:10am
TechXPOT, 1F

Missed the presentation? Request the slides.

07/10/2018: SEMICON West - Booth 1817, South Hall - Presenter

SEMICON West - Booth 1817, South Hall - Presenter

July 10-12, 2018 | Moscone Center | San Francisco, USA

Doug Suerich

"Architecting for agility: incorporating IIOT into your data collection"

Smart Manufacturing Pavilion, Meet the Experts Theater
Wednesday, July 11, 2018
10:30-11:00am

Equipment manufacturers are under pressure to reduce costs while maintaining or increasing quality and contributing to overall customer throughput. Increasingly, innovative end users are looking for big data solutions that will help them introduce extra efficiencies in their factories. While modern machine learning and artificial intelligence algorithms hold the promise of near-magical problem solving and fault detection capabilities, they have one major weakness: a voracious appetite for high volumes of data. These trends are increasing the demands on tool makers to provide even faster data collection and sensor data for variables that were not included in their original tool specifications. Meeting these demands from end customers requires the OEM to adopt an agile approach, where additional sensors and data collection plans can be deployed rapidly and customized on existing equipment platforms. The Industrial Internet of Things (IIoT) promises a solution to the hardware side of the problem (through the availability of cost-effective sensors, etc.) and capturing the data at the source, but this leaves unanswered questions around the best ways to share that data. The industry needs to consider equipment performance, security, stability, and long-term maintainability of the solution. Smart Manufacturing and data collection expert, Doug Suerich, discusses practical ways to meet these challenges without massive investment or diversion from existing SEMI Standards.

Missed the presentation? Request the slides.

05/24/2018: CPES2018 (Intelliflex) - Presenter

CPES2018 (Intelliflex) - Presenter

May 24, 2018 | Centennial College | Toronto, ON

Doug Suerich

"Moving towards High-Volume Manufacturing with standards"

Doug Suerich, Product Evangelist
10:00-10:15am

Doug will discuss moving toward high-volume FHE manufacturing with standards, by drawing on the lessons learned from the semiconductor industry to bridge the gap between prototyping and high-volume production.

Missed the presentation? Request the slides.

04/30/2018: Advanced Semiconductor Manufacturing Conference (ASMC) - Poster Presentation

Advanced Semiconductor Manufacturing Conference (ASMC) - Poster Presentation

April 30 - May 3, 2018 | Saratoga Springs, NY

Doug Suerich

Poster Presentation: "A systematic approach to secure data collection across an OEM's fleet of tools"

Doug Suerich, Product Evangelist
Tuesday, May 1, 2018
5:15-6:45pm, Session 5

This paper discusses the approaches the PEER Group team took to design and implement a secure data management system to collect data from tools installed at fabs in different geographic locations and to move that data to a cloud-based storage system. The motivation for our work was to find the best way to match equipment performance across a global fleet of tools using modern analytics for predictive decision-making. However, gathering the data and feeding it into remote analytics software to perform fleet-wide comparisons presents familiar obstacles related to IP protection, the management of big data, and implementation risk. The majority of the effort in creating such a data collection system did not lie in the movement of the data, but rather in the systematic identification and assessment of objections to data sharing in a notoriously secretive industry. By explicitly addressing each of the concerns related to secure data sharing, PEER Group was able to create a system that allowed for limited collection of data in a means acceptable to all stakeholders.

04/16/2018: APC|M Europe Conference - Presenter and Session Sponsor

APC|M Europe Conference - Presenter and Session Sponsor

April 16-18, 2018 | Dresden, Germany

Doug Suerich

"Secure Data Collection Across an OEM's Fleet of Tools"

Doug Suerich, Product Evangelist

PEER Group sponsored the "Factory productivity and automation" session

Missed the presentation? Request the slides.

03/14/2018: SEMICON China - Booth 2785, N2

SEMICON China - Booth 2785, N2

SEMICON China logo

March 14-16 | Shanghai New International Expo Centre | Shanghai, China

02/21/2018: Global Smart Manufacturing Summit - Presenter

Global Smart Manufacturing Summit - Presenter

February 21-23, 2018 | Marriott Hotel | Stuttgart, Germany

Michael Arnold

“CASE STUDY: Industry 4.0 – The Evolution of the Revolution” 

Michael Arnold, Managing Director, PEER Group GmbH
Wednesday, February 21, 2018
15:05

Michael’s case study will highlight the characteristics and driving factors of the industrial revolutions. He will provide an assessment of where we are today, the leadership question, and factors for success.

02/12/2018: 2018FLEX - Presenter and Session Sponsor

2018FLEX - Presenter and Session Sponsor

February 12-15, 2018 | Hyatt Regency Monterey Hotel & Spa | Monterey, California

Agenda: http://www.semi.org/en/2018flex-agenda

Doug Suerich

"Moving towards high-volume manufacturing with standards"

Doug Suerich, Product Evangelist
Thursday, February 15, 2018
9:25-9:45am

PEER Group sponsored the “Standards and Reliability” session on February 15

Revolutionary advances in flexible electronics hold the promise of producing innovative new products at lower cost than traditional methods. However, the gap between prototype production and high-volume manufacturing (HVM) can be daunting. How can you ensure that you have the infrastructure in place to move your process from the laboratory to the complexities and uncertainties of real-world manufacturing, especially in a smart factory? Fortunately, lessons learned in the semiconductor manufacturing industry provide clear guidance for making the move towards full automation and standardized data collection and material handling.

This presentation reviews the fundamental requirements for making the transition from pilot process to implementation inside a modern production facility and value chain. We’ll discuss design patterns and standards for automation, big data collection and security that you can implement now to help simplify future sales to demanding customers. We’ll also introduce a path for taking your HVM to the next level: introducing essential concepts for realizing Smart Manufacturing and Industry 4.0. Modern analytics can be used to monitor a fleet of deployed equipment to find opportunities for improvement (e.g., enabling predictive maintenance to reduce unplanned equipment downtime). However, this can only work if the collected data is consolidated securely into a central location. The basic data collection infrastructure we recommend paves the way for a complete, secure remote connectivity and data sharing solution that provides equipment makers and manufacturers a powerful new and secure way to collaborate.

Missed the presentation? Request the slides.

02/08/2018: ACM Education - Presenter

ACM Education - Presenter

Thursday, February 8, 2018 | FH Kärnten, Lakeside Park | Klagenfurt, Austria Michael Arnold

“Automation Capability Management: Lessons Learned in the Semiconductor Industry”

Michael Arnold, Managing Director, PEER Group GmbH
17:00

01/31/2018: SEMICON Korea - Booth 319, Hall D

SEMICON Korea - Booth 319, Hall D

SEMICON Korea logo

January 31 - February 2, 2018 | COEX | Seoul, Korea

12/13/2017:SEMICON Japan - Booth 3220, Hall 3

SEMICON Japan - Booth 3220, Hall 3

December 13-15, 2017

At SEMICON Japan, we co-exhibit with our Japanese distributor, Mizuho Information & Research

SEMICON Japan Logo

Tokyo Big Sight
Tokyo, Japan

Doug Suerich

SEMICON Japan - Presenter

Doug Suerich, Product Evangelist
"Using the cloud in a security-conscious industry"

Location: TechSPOT West
Date: Wednesday, December 13, 2017
Time: 13:40-14:30

Abstract:
Cloud computing promises new methods for process optimization. But, in an industry that is historically risk averse and security-conscious, many companies still hesitate to use the cloud. Our case study discusses how we leveraged the cloud’s speed, security, and cost advantages for data analytics.

11/14/2017:SEMICON Europa - Booth 1428, B1

SEMICON Europa - Booth 1428, B1

November 14-17, 2017

Doug presentation

Co-located with productronica
Messe München
Munich, Germany


SEMICON Europa - Presenter

Doug Suerich, Product Evangelist
"Data collection strategies for Smart Manufacturing"

Location: TechLOUNGE, B1
Date: Wednesday, November 15
Time: 12:15


IT2Industry and Productronica - Presenter 

Doug Suerich, Product Evangelist
“Incremental approaches to Smart Manufacturing” 

Location: Open Conference Stage, B2
Date: Wednesday, November 15
Time: 11:00

Abstract
Advanced manufacturers operate under relentless pressure to reduce costs while maintaining and – in many cases – increasing quality and throughput. Smart Manufacturing provides a solution to these challenges by harnessing the power of big data and predictive analytics to streamline manufacturing processes and improve decision making. This discussion outlines two case studies that provide clear lessons learned from Smart Manufacturing implementations in the electronics and life sciences industries. An investigation into the Smart Manufacturing practices of the semiconductor industry highlights the role that standards can play in reducing the cost and time required to implement a Smart Manufacturing solution. 


Michael Arnold

SEMICON Europa - Session Chair

Michael Arnold, Managing Director, PEER Group GmbH
Smart Manufacturing Session Chair

Location: TechARENA 1
Date: Thursday, November 16
Time: 10:00-12:30

Session agenda: http://semiconeuropa.org/techarena2017smartmanufacturingsession

10/18/2017:Canadian Intelligent Manufacturing Technology Roadshow, Industrial Automation Mission to Greater China Region – Participant

Canadian Intelligent Manufacturing Technology Roadshow, Industrial Automation Mission to Greater China Region – Participant

Ontario logoOctober 18-27, 2017

Organized by the Ontario Ministry of International Trade in cooperation with the Canadian Trade Commissioner Service in China and Taipei

Bill Schmalz, Vice-President, Sales

Bill Schmalz

Canada-Taiwan Smart Manufacturing Forum – Presenter

October 18, 2017

Taipai City, Taiwan

Bill Schmalz will present our vision for the future of Smart Manufacturing at this special forum  

10/09/2017:APC Conference XXIX 2017 - Presenter

APC Conference XXIX 2017 - Presenter

Doug Suerich

October 9-12, 2017

Doug Suerich, Product Evangelist
“Multi-site data collection: enabling fleet analytics and comparative analysis across global deployments”

Austin Airport Hilton Hotel
Austin, Texas

09/13/2017:SEMICON Taiwan - Booth 2834, 1F

SEMICON Taiwan - Booth 2834, 1F

September 13-15, 2017

SEMICON Taiwan logo

Taipei Nangang Exhibition Center
Taipei, Taiwan


SEMICON Taiwan - PresenterDoug Suerich

Doug Suerich, Product Evangelist
"Data collection strategies for Smart Manufacturing"

Location: TechXPOT 1F
Date: Wednesday, September 13, 2017
Time: 12:20

07/11/2017:SEMICON West - Booth 5250, North Hall

SEMICON West - Booth 5250, North Hall

July 11-13, 2017

SEMICON West logo

Moscone Center
San Francisco, USA


Global fleet management solution for OEMs 

06/13/2017:Atlantic Design & Manufacturing - Presenter

Doug Suerich - Atlantic Design & Manufacturing

Atlantic Design & Manufacturing - Presenter

Doug Suerich, Product Evangelist 
“Case Study: Smart Manufacturing Lessons Learned in Electronics, Life Sciences, and Semiconductor Industries” 

Smart Manufacturing Innovation Summit
Location: Jacob K. Javits Convention Center, New York, NY
Date: Tuesday, June 13, 2017
Time: 3:00-3:30pm

Abstract
Advanced manufacturers operate under relentless pressure to reduce costs while maintaining and – in many cases – increasing quality and throughput. Smart Manufacturing provides a solution to these challenges by harnessing the power of big data and predictive analytics to streamline manufacturing processes and improve decision making. This discussion outlines two case studies that provide clear lessons learned from Smart Manufacturing implementations in the electronics and life science industries. An investigation into the Smart Manufacturing practices of the semiconductor industry highlights the role that standards can play in reducing the cost and time required to implement a Smart Manufacturing solution. 

05/15/2017:ASMC 2017

ASMC 2017

ASMC 2017

May 15-18, 2017

Saratoga Hilton
Saratoga Springs, New York

04/10/2017:APC|M conference

APC|M conference

APC|M Europe

April 10-12, 2017

Gibson Hotel
Dublin, Ireland

03/14/2017:SEMICON China - Booth 2353, W2

SEMICON China - Booth 2353, W2

March 14-16, 2017

SEMICON China logo

Shanghai New International Expo Centre
Shanghai, China

02/08/2017:SEMICON Korea - Booth 5728, Hall D

SEMICON Korea - Booth 5728, Hall D

February 8-10, 2017

SEMICON Korea logo

COEX
Seoul, Korea

12/14/2016:SEMICON Japan - Presenter

SEMICON Japan - Presenter

Doug Suerich

Doug Suerich, Product Evangelist
“Leveraging SEMI standards to enable Smart Manufacturing in existing facilities”

TechSPOT WEST Exhibitor Presentations
Date: Wednesday, December 14
Time: 15:00

Abstract
The emerging IoT market is driving the growth of 200mm fabs which have traditionally not embraced the level of automation found in 300mm manufacturing facilities. However, as the demand for low-cost devices increases, better manufacturing control is becoming a must for all fabs. Emerging Smart Manufacturing technologies hold the promise of providing the flexibility required to respond rapidly and cost-effectively in both high-volume/low-mix and high-volume/high-mix production environments. However, adding such technologies can be challenging to implement in facilities with existing equipment and manufacturing operation systems that do not support easy customizations. This discussion proposes an architecture that leverages existing SEMI standards to retrofit a fab with the latest big data and analysis capabilities but without impacting existing equipment and operations.

12/14/2016:SEMICON Japan - Booth 3205, Hall 3

SEMICON Japan - Booth 3205, Hall 3

14-16 December 2016

At SEMICON Japan, we co-exhibit with our Japanese distributor, Mizuho Information & Research

SEMICON Japan Logo

Tokyo Big Sight
Tokyo, Japan

11/08/2016:electronica

electronica

8-11 November 2016

electronica logo

Messe München
Munich, Germany

11/07/2016:North America SEMI Standards Fall 2016 Meetings

North America SEMI Standards Fall 2016 Meetings

7-10 November 2016

PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.

Semi Logo

San Jose, CA
USA

10/26/2016:SEMICON Europa - Presenter

SEMICON Europa - Presenter

26 October 2016

Doug Suerich

Doug Suerich, Product Evangelist
“Turning Data into Action: The Importance of On-Tool Data Brokers for Enabling Big Data Analytics and Increasing Fab Productivity”

TechLOUNGE Session 2: Fab Productivity and Smart Manufacturing
Wednesday, October 26, 2016
12:00

Abstract 
In today’s connected world, Smart Manufacturing initiatives make it possible for semiconductor device makers to leverage data, gain insights into their processes, and make manufacturing decisions and processing modifications that will improve fab productivity. 

Data collection has always been an essential part of semiconductor manufacturing and now, successful big data solutions enable intelligent analysis and allow manufacturers and suppliers to turn their collected data into action. As the cost of adding more sensors and data sources to equipment continues to become more affordable, it’s important to consider how to broker high volumes of sensitive data at high speeds from disparate sources, how to consolidate the data on a single tool or across multiple tools to enable data analytics, and how to segregate IP and share information securely across business partners. 

Interconnecting equipment and process data provides new opportunities to fabs and OEMs to feed efficiency gains back into the manufacturing process. 

  • OEMs can analyze the data near-tool or even remotely and make equipment adjustments, ensure optimal equipment performance during production, and provide a higher standard of service to the fab through more efficient and cost-effective tool support. 
  • The fab will benefit from more efficient, autonomous manufacturing as it leverages equipment data to remove production inefficiencies, reduce costs, and improve uptime and yield. 

Join us in the TechLOUNGE as we explore the concept of data brokering through a secure pipe to enable a new generation of OEM and fab collaboration, central to Smart Manufacturing. 

10/25/2016:SEMICON Europa - Booth 362

SEMICON Europa - Booth 362

25-27 October 2016

SEMICON Europa logo

Alpexpo
Grenoble, France

10/25/2016:SEMICON Europa - Session Chair

SEMICON Europa - Session Chair

25 October 2016

Michael Arnold

Michael Arnold, Managing Director, PEER Group GmbH
Smart & Sustainable Manufacturing Session Chair
TechARENA 1
14:00-16:45

Session agenda: www.semiconeuropa.org/node/3396

10/20/2016:APC Conference IMA-APC Council Meeting - Presenter

APC Conference IMA-APC Council Meeting - Presenter

20 October 2016

Doug Suerich

Doug Suerich, Product Evangelist 

IMA-APC Council Meeting
Hilton Phoenix / Mesa Hotel, Arizona 
9am-12pm

Meeting topic: Security of Data and Intellectual Property in Fabs: Challenges and Potential Solutions
Meeting agenda: www.cvent.com/events/apc-conference-xxviii-2016

10/17/2016:APC Conference XXVIII 2016

APC Conference XXVIII 2016

17-20 October 2016

Hilton Phoenix / Mesa Hotel
Mesa, Arizona
USA

09/15/2016:European MEMS Summit 2016

European MEMS Summit 2016

MEMS Summit

15-16 September 2016

Maritim Hotel Stuttgart
Stuttgart, Germany

09/07/2016:SEMICON Taiwan

SEMICON Taiwan

7-9 September 2016

SEMICON Taiwan logo

Taipei Nangang Exhibition Center
Taipei, Taiwan

07/12/2016:SEMI Standards Meetings

SEMI Standards Meetings

12-14 July 2016

PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.

SEMI logo

Moscone Center
San Francisco, USA

07/12/2016:SEMICON West - Booth 1239, South Hall

SEMICON West - Booth 1239, South Hall

12-14 July 2016

SEMICON West logo

Moscone Center
San Francisco, USA

05/16/2016:ASMC 2016

ASMC 2016

16-19 May 2016

ASMC Logo

Saratoga Springs, USA

04/04/2016:North America SEMI Standards Spring 2016 Meetings

North America SEMI Standards Spring 2016 Meetings

4-7 April 2016

PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.

SEMI logo

San Jose, CA
USA

03/15/2016:SEMICON China

SEMICON China

15-17 March 2016

SEMICON China logo

Shanghai New International Expo Centre
Shanghai, China

01/27/2016:SEMICON Korea - Booth 5728, Hall D

SEMICON Korea - Booth 5728, Hall D

27-29 January 2016

At SEMICON Korea, we co-exhibit with our Korean distributor, ELIM Technology

SEMICON Korea logo

COEX
Seoul, Korea

12/16/2015: SEMICON Japan

SEMICON Japan - Booth 2304, Hall 2

16-18 December 2015 

SEMICON Japan 2015 logo

Location:
Tokyo Big Sight
Tokyo, Japan
Visit us and our Japanese distributor, Mizuho Information and Research Institute, in Booth 2304, Hall 2.

10/06/2015: SEMICON Europa

SEMICON Europa - Booth 1242

6-8 October 2015

SEMICON Europa 2015 logo

Location:
Messe Dresden
Dresden, Germany
Visit us in Booth 1242

10/06/2015: SEMICON Europa - Industry 4.0 Session Chair Michael Arnold

SEMICON Europa - Industry 4.0 Session Chair Michael Arnold

Michael Arnold

Location:
TechARENA 2, MESSE Dresden
Dresden, Germany

Session and Time:
Industry 4.0 Session
Chair / Moderator: Dr. Michael Arnold, Managing Director, PEER Group GmbH
6 October 2015
13:30-17:00

09/02/2015: SEMICON Taiwan

SEMICON Taiwan

2-4 September 2015

SEMICON Taiwan 2015 logo

Location:
TWTC Nangang Exhibition Hall
Taiwan

07/14/2015: SEMICON West

SEMICON West - Booth 1922, South Hall

14-16 July 2015

SEMICON West 2015 logo

Location:
Moscone Center
San Francisco, USA

04/13/2015: APC|M Europe Conference - Presenters

APC|M Europe Conference - Presenters

13-15 April 2015

APC|M Europe logo

Location:
Freising, Germany

PEER Group Speaker and Topic:
Roland Willmann
Presentation: "Transition of high automation manufacturing to Semantic Web Technologies"
Tuesday, April 14th

Abstract:
The presentation provides an insight to Semantic Web Technologies and how they support requirements which are discussed in the context of the Industry 4.0. initiative. The focus is twofold: on opportunities where Semantic Web Technology can be applied during a standardization process, and on a development path towards the application of Semantic Web Technology in a high-automation factory.

03/17/2015: SEMICON China

SEMICON China

17-19 March 2015

SEMICON China 2015 logo

Location:
Shanghai New International Expo Centre
Shanghai, China

02/08/2015: Trade Mission to South Korea - Delegate

Trade Mission to South Korea - Delegate

8-11 February 2015

Location:
Seoul, South Korea

Bill Schmalz joins Canada's Minister of International Trade, The Honorable Ed Fast, and other Canadian delegates on this trade mission.

02/04/2015: SEMICON Korea

SEMICON Korea - Booth 5750, Hall D

4-6 February 2015

SEMICON Korea 2015 logo Location:
COEX
Seoul, Korea
February 4-6, 2015
Visit us in Hall D, Booth 5750

12/03/2014:SEMICON Japan

SEMICON Japan

3-5 December 2014

SEMICON Japan 2014 logo

Location:
Tokyo Big Sight
Tokyo, Japan
Visit PEER Group at Mizuho Information
and Research Institute Inc.'s booth at: Hall 2, Booth 2007

11/20/2014SME Support Japan New Value Creation Exhibition 2014 - Presenter

SME Support Japan New Value Creation Exhibition 2014 - Presenter

20 November 2014

Michael Arnold

Location:
Tokyo Big Sight
Tokyo, Japan
 
PEER Group Speaker and Topic:
Dr. Michael Arnold - Managing Director, PEER Group GmbH
"Industry 4.0: An IT Solutions Company's Perspective"


Abstract:
The German initiative Industry 4.0 shall strengthen the country’s position as one of the leading industry regions and suppliers of factories by leveraging IT solutions for creating something revolutionary. The implementation, however, will take into account the business reality of existing and new factories and their equipment suppliers. Several elements of this process are discussed from the perspective and the experience of an IT solutions provider.

10/07/2014:SEMICON Europa - Presenter

SEMICON Europa - Presenter

7-9 October 201
SEMICON Europa 2014 logo

Location:
Alpexpo
Grenoble, France
Visit us in Booth 261

 
PEER Group Speaker and Topic:William Schmalz
William Schmalz - Director, Global OEM Sales
"An Agile Approach to Automation Software for Tool Control"

Location:
TechARENA 1
October 7, 2014
Time: 16:10

Abstract:
As fabs strive for more productive manufacturing processes, OEMs are forced to become more agile in the deployment of their tools. In the old paradigm of tool automation and control development, this requirement for agility causes tension between cost-effective tool development and long-term maintainability. We are presenting our suite of off-the-shelf tool automation development products architected specifically for the semiconductor tool maker to enable agility and cost-effective maintainability. Using our products, OEMs can meet the fab’s needs for productive manufacturing, while reducing turnaround times, time to market, and cost of ownership. Learn how PEER Group’s product team has designed our OEM product suite to help tool builders become more agile and cost effective at developing and supporting next-generation tool development.

09/03/2014:SEMICON Taiwan

SEMICON Taiwan

3-5 September 2014
SEMICON Taiwan 2014 logo

Location:
TWTC Nangang Exhibition Hall
Taiwan

07/08/2014:SEMICON West

SEMICON West

8-10 July 201
SEMICON West 2014 logo

Location:
Moscone Center
San Francisco, USA
Visit us in South Hall, Booth 1622

04/07/2014:APC|M Europe Conference - Presenter

APC|M Europe Conference - Presenter

7-9 April 2014

APC|M Europe logo

Location:
Rome, Italy

PEER Group Speaker and Topic:
Roland Willmann
"Fast Machine Ramp-up Through a Comprehensive Equipment Automation Platform"

Roland will talk about an innovative multilayer software architecture for equipment automation purposes. This architecture enables flexible and reusable abstraction of production equipment in order to improve collected data quality, ensure fast integration of new clustered production machines into the factories IT-landscape and therefore to save significant time during capacity ramp-up of your production. Typical cases are discussed as well.

03/18/2014:SEMICON China

SEMICON China

18-20 March 2014
SEMICON China 2014 logo

Location:
Shanghai New International Expo Centre
Shanghai, China

02/12/2014:SEMICON Korea

SEMICON Korea

12-14 February 201
SEMICON Korea 2014 logo

Location:
COEX
Seoul, Korea
Visit us in Hall B, Booth 4205

12/04/2013:SEMICON Japan

SEMICON Japan

4-6 December 2013

SEMICON Japan 2013 logoLocation:
Makuhari Messe
Chiba, Japan
Visit PEER Group at Mizuho Information
and Research Institute Inc.'s booth at: Hall 5, Booth 5B-404

10/08/2013:SEMICON Europa

SEMICON Europa

8-10 October 2013

SEMICON Europa 2013 logo

Location:
Messe Dresden
Dresden, Germany
Hall 1, Booth 1660

07/09/2013: SEMICON West

SEMICON West

9-11 July 2013

SEMICON West 2013 logoLocation:
Moscone Center
San Francisco, CA
South Hall, Booth 1647

03/19/2013:SEMICON China

SEMICON China

19-21 March 2013

SEMICON China 2013 logo

Location:
Shanghai New International Expo Centre
Shanghai, China
View our joint automation and control solution
with MKS Instruments in Booth 3461

01/31/2013:SEMICON Korea

SEMICON Korea

31 January - 1 February 2013

SEMICON Korea 2013 logoLocation:
COEX
Seoul, Korea

12/05/2012: SEMICON Japan

SEMICON Japan

5-7 December 2012

Location:
Makuhari Messe
Japan
Hall 5, Booth 5B-404

10/09/2012:SEMICON Europa

SEMICON Europa

9-11 October 2012

Location:
Messe Dresden
Dresden, Germany
Hall 1, Booth 1.222

09/27/2012:PEER Group and Owens Design seminar: Building Software Flexibility and Reliability into Automated Systems

PEER Group and Owens Design seminar: Building Software Flexibility and Reliability into Automated Systems

27 September 2012

Owens Design logoLocation:
47427 Fremont Blvd.
Fremont, California

07/10/2012:SEMICON West

SEMICON West

10-12 July 2012

Location:
Moscone Center
San Francisco, CA
South Hall, Booth 1643

12/07/2011:SEMICON Japan

SEMICON Japan

7-9 December 2011

Location:
Makuhari Messe,
Chiba, Japan

10/11/2011: SEMICON Europa

SEMICON Europa

11-13 October 2011

Location:
Messe Dresden,
Germany
Hall 1, Booth 1.035

09/15/2011:Process Optimization Workshop

Workshop Process Optimization, Continuous Improvement and Intelligent Process Control in the Daily Manufacturing Practice

25 September 2011

A joint workshop presented by GE Intelligent Platforms Europe S.A. and PEER Group GmbH.

Location:
Dresden, Germany

Today’s typical manufacturing processes are characterized by a high complexity governed by multidimensional cause-effect networks, the exploration of which can be a challenging endeavor. Nevertheless, root causes for process excursions and disturbances of the manufacturing process have to be identified and corrected for within the shortest timeframe possible. To do this successfully will require monitoring and control mechanisms of considerably higher performance and intelligence.

 With Proficy Troubleshooter and Proficy Cause+ our workshop introduces solutions of GE IP (General Electric / Intelligent Platforms), which enable process and manufacturing experts, automation and control engineers as well as maintenance specialists and teams to achieve faster process analysis, improved monitoring and optimized process control within a unified open framework. Besides talks which highlight several aspects of the functionality of Proficy Troubleshooter and Proficy Cause+, we will demonstrate the capabilities for analysis, optimization and improved process control using the example of a concurrent flow drying process.





Workshop Prozessoptimierung, kontinuierliche Verbesserung und intelligente Prozessführung in der betrieblichen Praxis

Donnerstag, 15. September 2011 in Dresden

Heutige Fertigungsprozesse sind geprägt durch eine typischerweise hohe Komplexität mit nicht einfach verstehbaren, vieldimensionalen Ursache-Wirkungs-Gefügen. Dennoch sind Ursachen für Abweichungen vom Sollverhalten und von Störungen des Prozesses in kürzester Zeit zu ermitteln und nachhaltig zu beseitigen. Dies gelingt nur durch eine wesentlich höhere Leistungsfähigkeit und Intelligenz der eingesetzten Regelungs- und Überwachungsverfahren. 

Unser Workshop stellt mit den Produkten Proficy Troubleshooter und Proficy Cause+ Lösungen von GE-IP (General Electric / Intelligent Platforms) vor, die es unter anderem Prozess- und Anlagenspezialisten, Automatisierungsfachleuten und Wartungs- und Instandhaltungsteams ermöglichen, die Zielstellungen einer schnelleren Problemanalyse, verbesserten Überwachung und optimierten Prozessregelung in einem einheitlichen und offenen Framework zu erreichen. Neben Vorträgen, die die Funktionalität von Proficy Troubleshooter und Proficy Cause+ beleuchten, demonstrieren wir Ihnen die Möglichkeiten zur Analyse, Optimierung und verbesserten Regelung Ihrer Prozesse und Verfahren am praktischen Beispiel eines Gleichstrom-Trockenprozesses.

07/12/2011: SEMICON West

SEMICON West

12-14 July 2011

Location:
San Francisco, CA
July 12-14, 2011
South Hall, Booth 419

AEC/APC North America 2010

AEC/APC Symposium Presentation

Title: The Importance of EEQA Common Component Template Definitions
Author(s): Mike Thiessen, Gino Crispieri
Affiliation: PEER Group, International SEMATECH Manufacturing Initiative (ISMI)
Presenter: Mike Thiessen

Abstract 

Enhanced Equipment Quality Assurance (EEQA) is the foundation of collaborative activities to lower cost and improve equipment availability in the semiconductor industry. Based on six important Equipment Engineering System (EES) guidelines that promote the definition, availability, and sharing of EES data, EEQA is the core activity that enables the OEM and IC maker to improve and increase equipment efficiency and reliability during its lifecycle.

EEQA requires the OEM to make functional equipment data available by specifying parametric data as defined by the EEQA Common Component Templates. These templates focus on the functions, events, and data parameters of the equipment’s main components that the supplier and/or IC maker identifies are critical when monitoring the overall equipment’s function and its components’ performance to ensure process reliability. EEQA Common Component Templates are also used by IC makers to confirm that the equipment functions as the OEM intended and to facilitate the visualization and analysis of the data. Once data is made available by the OEM, both the OEM and IC maker can use the data to visualize, determine, and understand the equipment’s behavior and monitor and improve its functional performance. EEQA data helps track and improve the equipment’s reliability and efficiency.

This presentation describes a collaborative effort between PEER Group and ISMI to identify common component data and events for equipment and highlights the importance of data that is not currently defined in any existing SEMI standard. Practical examples will focus on how this data can be managed on the tool and communicated to the IC maker. Additionally, the benefits of using this data for tool acceptance benchmarks will be analysed.