Archived Events

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Archived events

SEMICON JapanSEMICON Japan – Booth 3355, West Hall 2

December 11 – 13, 2019 | Tokyo Big Sight | Tokyo, Japan

SEMICON Europa – Booth B1744

November 12 – 15, 2019 | Messe München | Munich, Germany

“Smart Manufacturing I (Software-centric)” – Session Chair

Michael ArnoldMichael Arnold, Managing Director, PEER Group GmbH
TechARENA 1, Hall B1
Wednesday, November 13, 2019
11:30 – 13:30

“Simplifying your tool automation” – Presenter

Doug Suerich, Product Evangelist
TechLounge, Hall B2
Wednesday, November 13, 2019
10:00 – 10:15

Fabs are under continuous pressure to increase throughput, maximize yield, and reduce costs. These demands produce demanding equipment purchase specifications and place strict requirements on OEMs to provide more advanced automation and data management capabilities. Additionally, these requirements create an increasing burden on OEMs to provide best-in-class automation software to complement their process expertise. The best OEMs are making strategic decisions to ensure they can meet these factory needs efficiently today and in the future.Join us as we discuss how you can streamline the delivery of your tool automation, allowing your engineers to focus on your core capabilities, while ensuring rapid deployment of SEMI standards-compliant equipment automation software, enabling fast fab acceptance of your tools.

“Practical machine learning for tools” – Presenter

Doug SuerichDoug Suerich, Product Evangelist
Smart Manufacturing II (hardware-centric)
TechARENA 2, Hall B1
Thursday, November 14, 2019
13:55 – 14:25

Semiconductor equipment makers (OEMs) are under pressure to produce tools that offer the maximum possible substrate throughput while maintaining high process quality levels. Although actual processing time is often constrained by physical limits based on the underlying requirements of the process itself, overall throughput in a tool is also subject to non-productive time delays such as transfer time, equipment speed limitations, and vacuum pump down. Therefore, minimizing non-productive tool time is a key element in maximizing overall throughput.This case study investigates efforts made to use machine learning to improve throughput in a complex cluster tool. Traditional methods to find planner optimizations were successful, but required extensive amounts of non-recurring engineering expense. This led to an exploration of how modern machine learning algorithms could be used to streamline the planner optimization process and find solutions beyond what a human engineer could discover.

Advanced Process Control (APC) Conference – Tutorial Instructor and Sponsor

October 28-31, 2019 | Embassy Suites Riverwalk Hotel | San Antonio, Texas

Doug SuerichKaran“Learning to Share: Securing data access in a paranoid industry”

Co-instructors Doug Suerich, Product Evangelist & Karanvir Kang, Software Development Manager
Monday, October 28, 2019
Morning tutorial 8:00am – 12:00pm

Data lies at the very heart of APC, driving improvements across the entire manufacturing process and supply chain. Data enables run-to-run (R2R) control, fault detection and classification (FDC) and much more, including newer Smart Manufacturing initiatives like machine learning and artificial intelligence.

Access to data, both historical and real-time, is an absolute requirement before any APC efforts can even begin. However, secure data access is a serious challenge in the semiconductor industry. Many OEMs are unwilling to share data that could reveal their process secrets to other tool makers or their end customers. Fabs are reluctant to share information that could leak out to their competitors. Even fab customers have strict requirements around secrecy: no one wants an upcoming product feature to leak ahead of a planned release date.

Given these constraints to data sharing and data security, how can progress be made? How can we share data with those who need it, while protecting that same data from those who should not have access to it? In this tutorial, we will present the basics of secure data access, covering the concerns and solutions at a holistic level by considering the technologies, processes, standards, and best practices both from within semiconductor manufacturing and from other industries. In addition to examining the current state of the industry, we will look at future trends and upcoming possibilities that could be unlocked through access to more data.

This tutorial is structured so that all data users — from novices to experts — will benefit from a deeper understanding of how to protect the data you are already using, and how to better negotiate safe and secure access to data that might not be shared otherwise.

SEMICON Taiwan – Booth K3161, 1F

September 18 – 20, 2019 | Taipei Nangang Exhibition Center | Taipei, Taiwan

Doug Suerich“Accelerate your manufacturing with smart factory automation” – Presentation

Doug Suerich, Product Evangelist
Booth J3258, 1F, Smart Manufacturing Journey
Wednesday, September 18, 2019
13:30-13:50

SEMI Smart Manufacturing Workshop – Premium Sponsor and Presenter

September 12, 2019 | SEMI Global Headquarters | Milpitas, California

Doug Suerich“Can we talk? Next-gen communication for Smart Manufacturing”

Doug Suerich, Product Evangelist
Communication Protocols and Best Practices Session
Thursday, September 12, 2019
1:40pm – 2:05pm

TSIAeManufacturing & Design Collaboration Symposium (eMDC) – Sponsor

September 6, 2019 | The Ambassador Hotel Hsinchu | Hsinchu City, Taiwan

SEMICON West – Booth 661, South Hall

July 9 – 11, 2019 | Moscone Center | San Francisco, USA
Doug Suerich

Panel – Securing the Foundation: Building a Trusted Silicon Supply Chain

Doug Suerich, Product Evangelist
TechTALKS Stage South
Tuesday, July 9, 2019
11:25am – 12:25pm

Doug and fellow panel members will be discussing critical components to build a secure global supply chain for chip manufacturing.

Silicon Saxony Day

Michael ArnoldJune 18, 2019 | Dresden International Airport | Dresden, Germany

Smart Automation Expert Session – Session Chair

Michael Arnold, Managing Director, PEER Group GmbH
10:00 – 12:00

Silicon Alps: Digital Dialog Day – Presentation

Michael ArnoldMay 28, 2019 | Silicon Alps Cluster GmbH | Villach, Austria

Machine connectivity: The rocky road to conformance of factory requirements

Michael Arnold, Managing Director, PEER Group GmbH

Advanced Semiconductor Manufacturing Conference (ASMC)

May 6 – 9, 2019 | Saratoga Hilton City Center | Saratoga Springs, New York

Doug Suerich“Machine learning for optimized scheduling in complex semiconductor equipment” – Poster session
Doug Suerich, Product Evangelist

Semiconductor cluster tools add an integral component to the modern semiconductor manufacturing process. These complex tools provide a flexible deployment option to group multiple processing steps into a single piece of equipment, allowing for more efficient processing. They also contribute to a reduction in the number of times a wafer must go through the atmospheric-vacuum-atmospheric cycle. These highly automated tools present a complex scheduling challenge where process-specific requirements are balanced against a need to achieve maximum wafer throughput in a fault-tolerant manner. Software engineers typically build schedulers using a set of manually-configured heuristics but this can be a labor-intensive process where small changes to the cluster configuration or process requirements can require large changes to the scheduler. Our motivation for this work was to investigate whether a machine learning approach to complex scheduling could be developed more efficiently and at a lower cost than existing methods.

Advanced Process Control and Manufacturing (apc|m) Conference

April 8 – 10, 2019 | Congress Center Villach | Villach, Austria

“Cybersecurity for OEMs: protecting equipment against cyber threats” – Presentation

Doug SuerichDoug Suerich, Product Evangelist 
Wednesday, April 10, 2019
11:00 – 13:00

Highly-automated semiconductor manufacturing relies on machine-to-machine (M2M) and machine-to-host connectivity. But, this introduces a security risk for both equipment makers and factories. A virus on a single tool could cause costly factory-wide downtime and fabs are beginning to demand that OEMs plan for long-term OS maintenance and updates to their products. OEMs are under pressure to find economical methodologies to meet these demands for entire fleets of tools. We’ll introduce a cost-efficient process for maintaining security on a tool over a multi-decade lifespan, as well as an updated philosophy for long-term tool maintenance permitting OEMs to provide the level of ongoing support demanded by fabs.

SEMICON China – Booth 7139, E7

March 20 – 22, 2019 | Shanghai New International Expo Centre | Shanghai, China

“Managing Big Data for Smart Manufacturing” – Presentation

Doug SuerichDoug Suerich, Product Evangelist 
Smart Manufacturing Forum
New Tech Stage, Hall E7
Thursday, March 21, 2019
15:35 – 16:05

Big data management provides big opportunities for OEMs. All semiconductor OEMs understand the importance of data: it drives manufacturing improvements (e.g., tells you where and when to add more sensors, how to perform faster sampling, and how to integrate different sources). Collecting large data volumes (e.g., EDA data) enables deep insight into critical manufacturing process and production metrics, and opens the possibility of using advanced analytics and machine learning to speed defect analysis and reduce repair times. Join us to learn how standards-based data management solutions will enable high-speed data collection and storage, and how you can leverage best practices to take advantage of Smart Manufacturing opportunities quickly and inexpensively.

Learn how we can help you store 10x more data, 450x faster than with a SQL database, and use only 1/10th the database size. Typical database solutions cannot handle your big data demands. Our connectivity solutions do. We leverage time-series data collection for data that is collected sequentially (e.g., from processing equipment and sensors at time intervals). The result: significantly faster and more efficient data collection, storage and retrieval.

“Fast, Efficient EDA Data Collection, Storage and Retrieval” – Presentation

Doug Suerich, Product Evangelist 
Presentations from PEER Group’s booth 7139, E7
Doug will present at these times:

March calandar

Learn how we can help you store 10x more data, 450x faster than with a SQL database, and use only 1/10th the database size. Typical database solutions cannot handle your big data demands. Our connectivity solutions do. We leverage time-series data collection for data that is collected sequentially (e.g., from processing equipment and sensors at time intervals). The result: significantly faster and more efficient data collection, storage and retrieval.

SEMICON Korea – Booth 804, Hall C

January 23 – 25, 2019 | COEX | Seoul, Korea
Doug Suerich

“Single Device Tracking Taskforce Updates” – Presentation

Doug Suerich, Product Evangelist 
Korea I&C Committee
Room 300, Conference Room (South)
Thursday, January 24, 2019
11:10 – 11:50

SEMICON Japan – Booth 3413, Hall 3

SEMICON JapanDecember 12-14, 2018 | Tokyo Big Sight | Tokyo, Japan

At SEMICON Japan, we co-exhibit with our Japanese distributor, Mizuho Information & Research

“Supply chain transparency to meet the future of productivity”

Doug SuerichDoug Suerich, Product Evangelist 
Traceability Workshop for IoT and Microelectronics Manufacturing Supply Chain
Conference room 607, Tokyo Big Sight
Wednesday, December 12, 2018
11:00 – 12:40


“HTTP/2 with gRPC and protocol buffers: leveraging new technology for better, more efficient data transfers”

Albert Fuchigami Albert Fuchigami, Senior Software Developer
North America DDA Task Force Co-Chair

EDA Workshop
Conference Room 607, Tokyo Big Sight
Wednesday, December 12, 2018
14:00-17:00


“Cybersecurity for OEMs: protecting your tools against cyber threats”

Doug Suerich, Product Evangelist
TechSPOT INNOVATION & IoT
East Hall 3
Thursday, December 13, 2018
12:40 – 13:30

Semiconductor manufacturing relies on machine connectivity. But, this introduces a security risk for both equipment makers and factories. A virus on a single tool could cause costly factory-wide downtime. This talk explores the need for OEMs to set up an ongoing equipment maintenance strategy.

SEMI Smart Manufacturing Workshop – Session Leader, Presenter, Sponsor

November 28, 2018 | SEMI International Headquarters | Milpitas, CA

Join SEMI’s Smart Manufacturing Technology Community at this one-day workshop to discuss real-world use cases for Smart Manufacturing and how you can leverage it for better business results.

Doug SuerichDoug Suerich will lead the Security breakout session – Access Data/Data Sharing, Data Policies – which will look at:

  • Data management and policies for the different types, classes and levels of data generated in a Smart Manufacturing environment
  • Data access and transfer protocols
  • Existing and needed standards to raise security “comfort levels”

Doug will also present the latest IMA APC Council meeting results.

Click here to register for the workshop: https://bit.ly/2AoggEE

SEMICON Europa – Booth A4445, A4

SEMICON EuropaNovember 13-16, 2018 | Messe München | Munich, Germany

“Helping OEMs scale up to big data volumes”

Mike BarrettMike Barrett, Director, Global OEM Sales 
TechLOUNGE Hall A4
Wednesday, November 14, 2018
12:00

The market is demanding faster throughput, smaller feature sizes and higher quality. Data is the fuel that drives these improvements – from more sensors to faster sampling and greater integration of different sources. Collecting larger data volumes allows for deeper insight into critical process and production metrics and provides the possibility of using advanced analytics and machine learning to speed defect analysis and reduce repair times. However, this explosion of big data can overwhelm traditional data sharing and storage mechanisms. Join us as we discuss cutting edge approaches to managing your data including new storage solutions, best practices for where your data should live and methods for sharing that data with your analysis systems and global experts.

Missed the presentation? Request the slides.


“Smart Manufacturing”

Michael ArnoldSession Chair: Michael Arnold, Managing Director, PEER Group GmbH
TechARENA 1, Hall A4
Wednesday, November 14, 2018
11:45 – 13:50

http://www.semiconeuropa.org/show-floor-techarena#5


“Cybersecurity for factories and tools: protecting yourself against potential threats”

Doug SuerichDoug Suerich, Product Evangelist
TechARENA 1, Hall A4
Wednesday, November 14, 2018
13:25

Highly-automated semiconductor manufacturing relies on machine-to-machine (M2M) and machine-to-host connectivity. But, this introduces a security risk for both equipment makers and factories. A virus on a single tool could cause costly factory-wide downtime. Forward-thinking OEMs are wondering whether they have protected their equipment adequately against potential cyber threats. Forward-thinking factories are considering all of the equipment on their manufacturing floors to ensure they stay risk free. This talk explores the need for OEMs to set up an ongoing equipment maintenance strategy that takes into consideration several important steps: upgrading all tools to modern-day operating systems that enable virus scanning, installing new connectivity software products to support new technologies and new factory requirements, and leveraging the secure remote connectivity to perform remote virus scans on all files moving into the factory, manage ongoing equipment maintenance activities to keep tools up to date, audit production tools to address software end of service (EOS) issues, and avoid causing factory-wide downtime by introducing a virus.

Missed the presentation? Request the slides.

Advanced Process Control (APC) Conference – Presenter and Sponsor

October 8-11, 2018 | Airport Hilton Hotel | Austin, TX

“Building the road to Smart Manufacturing”

Doug SuerichDoug Suerich, Product Evangelist
Tuesday, October 9, 2018
4:30pm

The International Roadmap for Devices and Systems (IRDS) maintains a 15-year technology roadmap covering many areas, including Smart Manufacturing and Industry 4.0, for the devices and systems industries. This talk introduces work currently underway by some SEMI® task forces and technical committees to update the SEMI standards in an effort to enable the vision proposed by the IRDS roadmap and move the state of the industry forward.

Missed the presentation? Request the slides.


“Throughput optimization in sophisticated equipment”

Doug Suerich, Product Evangelist
Wednesday, October 10, 2018
11:30am

This talk presents a case study in which we investigated throughput optimization opportunities on a complex cluster tool and increased throughput by 13% using only software and configuration changes.

Missed the presentation? Request the slides.

SEMICON Taiwan – Booth K2666, 1F

September 5-7, 2018 | Taipei Nangang Exhibition Center | Taipei, Taiwan

“Speed the way to Smart Manufacturing with standards-compliant factory automation software”

Mike TMike Thiessen, Product Engineering Manager
Wednesday, September 5, 4:45pm
Smart Manufacturing Forum, 5F

Industry 4.0 promises revolutionary improvements in quality, throughput and speed to market. To support next-generation manufacturing initiatives, factory automation software systems need to be fault-tolerant, fast and reliable. However, the initial investment for Smart Manufacturing can seem like a barrier. This talk highlights how companies can leverage existing SEMI® standards to capture best practices and build on the learnings of others, helping you lower costs and deliver projects on time.

Missed the presentation? Request the slides.


“Smart station controllers for Smart Manufacturing”

Mike Thiessen, Product Engineering Manager
Friday, September 7, 11:10am
TechXPOT, 1F

Missed the presentation? Request the slides.

SEMICON West – Booth 1817, South Hall – Presenter

July 10-12, 2018 | Moscone Center | San Francisco, USA

“Architecting for agility: incorporating IIOT into your data collection”

Doug SuerichDoug Suerich, Product Evangelist 
Smart Manufacturing Pavilion, Meet the Experts Theater
Wednesday, July 11, 2018
10:30-11:00am

Equipment manufacturers are under pressure to reduce costs while maintaining or increasing quality and contributing to overall customer throughput. Increasingly, innovative end users are looking for big data solutions that will help them introduce extra efficiencies in their factories. While modern machine learning and artificial intelligence algorithms hold the promise of near-magical problem solving and fault detection capabilities, they have one major weakness: a voracious appetite for high volumes of data. These trends are increasing the demands on tool makers to provide even faster data collection and sensor data for variables that were not included in their original tool specifications. Meeting these demands from end customers requires the OEM to adopt an agile approach, where additional sensors and data collection plans can be deployed rapidly and customized on existing equipment platforms. The Industrial Internet of Things (IIoT) promises a solution to the hardware side of the problem (through the availability of cost-effective sensors, etc.) and capturing the data at the source, but this leaves unanswered questions around the best ways to share that data. The industry needs to consider equipment performance, security, stability, and long-term maintainability of the solution. Smart Manufacturing and data collection expert, Doug Suerich, discusses practical ways to meet these challenges without massive investment or diversion from existing SEMI Standards.

Missed the presentation? Request the slides.

CPES2018 (Intelliflex) – Presenter

May 24, 2018 | Centennial College | Toronto, ON

“Moving towards High-Volume Manufacturing with standards”

Doug SuerichDoug Suerich, Product Evangelist
10:00-10:15am

Doug will discuss moving toward high-volume FHE manufacturing with standards, by drawing on the lessons learned from the semiconductor industry to bridge the gap between prototyping and high-volume production.

Missed the presentation? Request the slides.

Advanced Semiconductor Manufacturing Conference (ASMC) – Poster Presentation

April 30 – May 3, 2018 | Saratoga Springs, NY

Poster Presentation: “A systematic approach to secure data collection across an OEM’s fleet of tools”

Doug SuerichDoug Suerich, Product Evangelist
Tuesday, May 1, 2018
5:15-6:45pm, Session 5

This paper discusses the approaches the PEER Group team took to design and implement a secure data management system to collect data from tools installed at fabs in different geographic locations and to move that data to a cloud-based storage system. The motivation for our work was to find the best way to match equipment performance across a global fleet of tools using modern analytics for predictive decision-making. However, gathering the data and feeding it into remote analytics software to perform fleet-wide comparisons presents familiar obstacles related to IP protection, the management of big data, and implementation risk. The majority of the effort in creating such a data collection system did not lie in the movement of the data, but rather in the systematic identification and assessment of objections to data sharing in a notoriously secretive industry. By explicitly addressing each of the concerns related to secure data sharing, PEER Group was able to create a system that allowed for limited collection of data in a means acceptable to all stakeholders.

APC|M Europe Conference – Presenter and Session Sponsor

April 16-18, 2018 | Dresden, Germany

Doug Suerich“Secure Data Collection Across an OEM’s Fleet of Tools”

Doug Suerich, Product Evangelist

PEER Group sponsored the “Factory productivity and automation” session

Missed the presentation? Request the slides.

SEMICON China – Booth 2785, N2

SEMICON ChinaMarch 14-16 | Shanghai New International Expo Centre | Shanghai, China

Global Smart Manufacturing Summit – Presenter

February 21-23, 2018 | Marriott Hotel | Stuttgart, Germany

Michael Arnold“CASE STUDY: Industry 4.0 – The Evolution of the Revolution”

Michael Arnold, Managing Director, PEER Group GmbH
Wednesday, February 21, 2018
15:05

Michael’s case study will highlight the characteristics and driving factors of the industrial revolutions. He will provide an assessment of where we are today, the leadership question, and factors for success.

2018FLEX – Presenter and Session Sponsor

February 12-15, 2018 | Hyatt Regency Monterey Hotel & Spa | Monterey, California

Agenda: http://www.semi.org/en/2018flex-agenda

“Moving towards high-volume manufacturing with standards”

Doug SuerichDoug Suerich, Product Evangelist
Thursday, February 15, 2018
9:25-9:45am

PEER Group sponsored the “Standards and Reliability” session on February 15

Revolutionary advances in flexible electronics hold the promise of producing innovative new products at lower cost than traditional methods. However, the gap between prototype production and high-volume manufacturing (HVM) can be daunting. How can you ensure that you have the infrastructure in place to move your process from the laboratory to the complexities and uncertainties of real-world manufacturing, especially in a smart factory? Fortunately, lessons learned in the semiconductor manufacturing industry provide clear guidance for making the move towards full automation and standardized data collection and material handling.

This presentation reviews the fundamental requirements for making the transition from pilot process to implementation inside a modern production facility and value chain. We’ll discuss design patterns and standards for automation, big data collection and security that you can implement now to help simplify future sales to demanding customers. We’ll also introduce a path for taking your HVM to the next level: introducing essential concepts for realizing Smart Manufacturing and Industry 4.0. Modern analytics can be used to monitor a fleet of deployed equipment to find opportunities for improvement (e.g., enabling predictive maintenance to reduce unplanned equipment downtime). However, this can only work if the collected data is consolidated securely into a central location. The basic data collection infrastructure we recommend paves the way for a complete, secure remote connectivity and data sharing solution that provides equipment makers and manufacturers a powerful new and secure way to collaborate.

Missed the presentation? Request the slides.

ACM Education – Presenter

Thursday, February 8, 2018 | FH Kärnten, Lakeside Park | Klagenfurt, Austria

Michael Arnold“Automation Capability Management: Lessons Learned in the Semiconductor Industry”

Michael Arnold, Managing Director, PEER Group GmbH
17:00

SEMICON Korea – Booth 319, Hall D

SEMICON KoreaJanuary 31 – February 2, 2018 | COEX | Seoul, Korea

SEMICON Japan – Booth 3220, Hall 3

SEMICON JapanDecember 13-15, 2017

At SEMICON Japan, we co-exhibit with our Japanese distributor, Mizuho Information & Research

Tokyo Big Sight
Tokyo, Japan

SEMICON Japan – Presenter

Doug SuerichDoug Suerich, Product Evangelist
“Using the cloud in a security-conscious industry”

Location: TechSPOT West
Date: Wednesday, December 13, 2017
Time: 13:40-14:30

Abstract:
Cloud computing promises new methods for process optimization. But, in an industry that is historically risk averse and security-conscious, many companies still hesitate to use the cloud. Our case study discusses how we leveraged the cloud’s speed, security, and cost advantages for data analytics.

SEMICON Europa – Booth 1428, B1

SEMICON EuropaNovember 14-17, 2017

Co-located with productronica
Messe München
Munich, Germany

SEMICON Europa – Presenter

Doug SuerichDoug Suerich, Product Evangelist
“Data collection strategies for Smart Manufacturing”

Location: TechLOUNGE, B1
Date: Wednesday, November 15
Time: 12:15


IT2Industry and Productronica – Presenter

Productronica logoDoug Suerich, Product Evangelist
“Incremental approaches to Smart Manufacturing” 

Location: Open Conference Stage, B2
Date: Wednesday, November 15
Time: 11:00

Abstract
Advanced manufacturers operate under relentless pressure to reduce costs while maintaining and – in many cases – increasing quality and throughput. Smart Manufacturing provides a solution to these challenges by harnessing the power of big data and predictive analytics to streamline manufacturing processes and improve decision making. This discussion outlines two case studies that provide clear lessons learned from Smart Manufacturing implementations in the electronics and life sciences industries. An investigation into the Smart Manufacturing practices of the semiconductor industry highlights the role that standards can play in reducing the cost and time required to implement a Smart Manufacturing solution.


SEMICON Europa – Session Chair

Michael ArnoldMichael Arnold, Managing Director, PEER Group GmbH
Smart Manufacturing Session Chair

Location: TechARENA 1
Date: Thursday, November 16
Time: 10:00-12:30

Session agenda: http://semiconeuropa.org/techarena2017smartmanufacturingsession

Canadian Intelligent Manufacturing Technology Roadshow, Industrial Automation Mission to Greater China Region – Participant

October 18-27, 2017

Ontario logoOrganized by the Ontario Ministry of International Trade in cooperation with the Canadian Trade Commissioner Service in China and Taipei

Canada-Taiwan Smart Manufacturing Forum – Presenter

October 18, 2017

BillBill Schmalz, Vice-President, Sales
Taipai City, Taiwan

Bill Schmalz will present our vision for the future of Smart Manufacturing at this special forum

APC Conference XXIX 2017 – Presenter

October 9-12, 2017

Doug SuerichDoug Suerich, Product Evangelist
“Multi-site data collection: enabling fleet analytics and comparative analysis across global deployments”

Austin Airport Hilton Hotel
Austin, Texas

SEMICON Taiwan – Booth 2834, 1F

SEMICON TaiwanSeptember 13-15, 2017

Taipei Nangang Exhibition Center
Taipei, Taiwan

SEMICON Taiwan – Presenter

Doug SuerichDoug Suerich, Product Evangelist
“Data collection strategies for Smart Manufacturing”

Location: TechXPOT 1F
Date: Wednesday, September 13, 2017
Time: 12:20

SEMICON West – Booth 5250, North Hall

SEMICON WestJuly 11-13, 2017

Moscone Center
San Francisco, USA

Global fleet management solution for OEMs
  • See our news release for more details
  • Book your live software demo

Atlantic Design & Manufacturing – Presenter

Doug SuerichDoug Suerich, Product Evangelist
“Case Study: Smart Manufacturing Lessons Learned in Electronics, Life Sciences, and Semiconductor Industries” 

Smart Manufacturing Innovation Summit
Location: Jacob K. Javits Convention Center, New York, NY
Date: Tuesday, June 13, 2017
Time: 3:00-3:30pm

AD&M LogoAbstract
Advanced manufacturers operate under relentless pressure to reduce costs while maintaining and – in many cases – increasing quality and throughput. Smart Manufacturing provides a solution to these challenges by harnessing the power of big data and predictive analytics to streamline manufacturing processes and improve decision making. This discussion outlines two case studies that provide clear lessons learned from Smart Manufacturing implementations in the electronics and life science industries. An investigation into the Smart Manufacturing practices of the semiconductor industry highlights the role that standards can play in reducing the cost and time required to implement a Smart Manufacturing solution.

ASMC 2017

ASMC 2017May 15-18, 2017

Saratoga Hilton
Saratoga Springs, New York

APC|M conference

APCM EuropeApril 10-12, 2017

Gibson Hotel
Dublin, Ireland

SEMICON China – Booth 2353, W2

SEMICON ChinaMarch 14-16, 2017

Shanghai New International Expo Centre
Shanghai, China

SEMICON Korea – Booth 5728, Hall D

SEMICON KoreaFebruary 8-10, 2017

COEX
Seoul, Korea

SEMICON Japan – Presenter

Doug SuerichDoug Suerich, Product Evangelist
“Leveraging SEMI standards to enable Smart Manufacturing in existing facilities”

TechSPOT WEST Exhibitor Presentations
Date: Wednesday, December 14
Time: 15:00

Abstract
The emerging IoT market is driving the growth of 200mm fabs which have traditionally not embraced the level of automation found in 300mm manufacturing facilities. However, as the demand for low-cost devices increases, better manufacturing control is becoming a must for all fabs. Emerging Smart Manufacturing technologies hold the promise of providing the flexibility required to respond rapidly and cost-effectively in both high-volume/low-mix and high-volume/high-mix production environments. However, adding such technologies can be challenging to implement in facilities with existing equipment and manufacturing operation systems that do not support easy customizations. This discussion proposes an architecture that leverages existing SEMI standards to retrofit a fab with the latest big data and analysis capabilities but without impacting existing equipment and operations.

SEMICON Japan – Booth 3205, Hall 3

SEMICON Japan14-16 December 2016

At SEMICON Japan, we co-exhibit with our Japanese distributor, Mizuho Information & Research

Tokyo Big Sight
Tokyo, Japan

electronica

electronica8-11 November 2016

Messe München
Munich, Germany

North America SEMI Standards Fall 2016 Meetings

SEMI Logo7-10 November 2016

PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.

San Jose, CA
USA

SEMICON Europa – Presenter

26 October 2016

Doug SuerichDoug Suerich, Product Evangelist
“Turning Data into Action: The Importance of On-Tool Data Brokers for Enabling Big Data Analytics and Increasing Fab Productivity”

TechLOUNGE Session 2: Fab Productivity and Smart Manufacturing
Wednesday, October 26, 2016
12:00

Abstract 
In today’s connected world, Smart Manufacturing initiatives make it possible for semiconductor device makers to leverage data, gain insights into their processes, and make manufacturing decisions and processing modifications that will improve fab productivity.

Data collection has always been an essential part of semiconductor manufacturing and now, successful big data solutions enable intelligent analysis and allow manufacturers and suppliers to turn their collected data into action. As the cost of adding more sensors and data sources to equipment continues to become more affordable, it’s important to consider how to broker high volumes of sensitive data at high speeds from disparate sources, how to consolidate the data on a single tool or across multiple tools to enable data analytics, and how to segregate IP and share information securely across business partners.

Interconnecting equipment and process data provides new opportunities to fabs and OEMs to feed efficiency gains back into the manufacturing process.

  • OEMs can analyze the data near-tool or even remotely and make equipment adjustments, ensure optimal equipment performance during production, and provide a higher standard of service to the fab through more efficient and cost-effective tool support.
  • The fab will benefit from more efficient, autonomous manufacturing as it leverages equipment data to remove production inefficiencies, reduce costs, and improve uptime and yield.

Join us in the TechLOUNGE as we explore the concept of data brokering through a secure pipe to enable a new generation of OEM and fab collaboration, central to Smart Manufacturing.

SEMICON Europa – Booth 362

SEMICON Europa25-27 October 2016

Alpexpo
Grenoble, France

SEMICON Europa – Session Chair

Michael Arnold25 October 2016

Michael Arnold, Managing Director, PEER Group GmbH
Smart & Sustainable Manufacturing Session Chair
TechARENA 1
14:00-16:45

Session agenda: www.semiconeuropa.org/node/3396

APC Conference IMA-APC Council Meeting – Presenter

Doug Suerich20 October 2016

Doug Suerich, Product Evangelist

IMA-APC Council Meeting
Hilton Phoenix / Mesa Hotel, Arizona
9am-12pm

Meeting topic: Security of Data and Intellectual Property in Fabs: Challenges and Potential Solutions
Meeting agenda: www.cvent.com/events/apc-conference-xxviii-2016

APC Conference XXVIII 2016

17-20 October 2016

Hilton Phoenix / Mesa Hotel
Mesa, Arizona
USA

European MEMS Summit 2016

MEMS15-16 September 2016

Maritim Hotel Stuttgart
Stuttgart, Germany

SEMICON Taiwan

SEMICON Taiwan7-9 September 2016

Taipei Nangang Exhibition Center
Taipei, Taiwan

SEMI Standards Meetings

SEMI Logo12-14 July 2016

PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.

Moscone Center
San Francisco, USA

SEMICON West – Booth 1239, South Hall

SEMICON West12-14 July 2016

Moscone Center
San Francisco, USA

ASMC 2016

16-19 May 2016

Saratoga Springs, USA

North America SEMI Standards Spring 2016 Meetings

SEMI Logo4-7 April 2016

PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.

San Jose, CA
USA