Archived Events
News & events / Events / Archived events
Archived events
SEMICON Japan – Booth E6527
December 17-19, 2025 | Tokyo Big Sight | Tokyo, Japan
SEMICON Europa – Booth B1257
November 18-21, 2025 | Messe München | Munich, Germany
SEMICON West – Booth 1441
October 7-9, 2025 | Phoenix Convention Center | Phoenix, USA
Advanced Process Control Smart Manufacturing Conference (APCSM)
September 22-25, 2025 | The Cliff Lodge | Snowbird, Utah
The Advanced Process Control Smart Manufacturing Conference is an in-person technical conference comprising networking events, tutorials, and technical presentations.
A long-time supporter of the APCSM, PEER Group is excited to attend this year to learn about the latest innovations and advancements in APC and share our industry knowledge and expertise.
PEER Group’s Director of Marketing, Doug Suerich, will be in attendance during the conference. Doug, who also co-chairs the APCSM and is a Governing Council member of the Semiconductor Manufacturing Cybersecurity Consortium (SMCC), will present An Industry Plan for Cybersecurity.
Joining Doug is Ryan Daniel, PEER Group’s Sales Engineer, Factory Sales for North America. Connect with Ryan to learn about PEER Group’s best-in-class factory automation and connectivity products and services.
Doug and Ryan look forward to connecting with everyone in Snowbird, Utah!
Doug Suerich
Director of Marketing, PEER Group
Ryan Daniel
Sales Engineer, Factory Sales, PEER Group
SEMICON Taiwan – Booth N0289
September 10-12, 2025 | TaiNEX | Taipei, Taiwan
Webinar: SEMI Cybersecurity Standard E187: Are you ready?
1:00 p.m. EDT, July 24, 2025
Join Doug Suerich, Governing Council member of the Semiconductor Manufacturing Cybersecurity Consortium (SMCC), as he provides an in-depth breakdown of SEMI Cybersecurity Standard E187 and explains what equipment makers must do to achieve compliance and meet the factory specification.
Attend this webinar to learn:
- Why now is the time to act on cybersecurity.
- How the industry is responding to these threats.
- Which SEMI Cybersecurity Standards are already appearing in fab specs.
- How to comply with SEMI E187.
Silicon Saxony Day – Booth C14
June 17, 2025 | Dresden Airport | Dresden, Germany
Silicon Saxony Day brings together members of the global microelectronics industry for a full day of keynote speeches, presentations, exhibits, and more.
Advanced Semiconductor Manufacturing Conference (ASMC)
May 5-8, 2025 | Hilton Albany | Albany, USA
ASMC is an annual technical conference that brings together manufacturers, equipment and materials suppliers, and academia to solve manufacturing challenges with innovative strategies and methodologies.
Doug Suerich, PEER Group’s Director of Marketing and Governing Council Member of the Semiconductor Manufacturing Cybersecurity Consortium (SMCC), along with Mayura Padmanabhan, SMCC Program Manager, will co-present “An Industry Plan for Cybersecurity.” The presentation will provide a thorough overview of SMCC activities, updates, and results. Topics covered will include Cybersecurity SEMI Standards E187, E188, and E191, the SMCC’s collaboration with NIST, and much more.
Doug Suerich
Director of Marketing, PEER Group
SEMI — Fab Owners Alliance (FOA) Q2
April 30 – May 1, 2025 | Honeywell | Plymouth, USA
The FOA Q2 Membership Meeting will occur at Honeywell in Plymouth, MN. Connect with Bob Kane, Director of North American Sales, and Ryan Daniel, Sales Engineer, Factory Sales, during the event to learn how PEER Group helps factories optimize operations through innovative automation, connectivity, and station controller solutions and services.
European Advanced Process Control and Manufacturing (apc|m) Conference
April 8-10, 2025 | Prague Congress Centre | Prague, Czech Republic
PEER Group experts will be onstage sharing their knowledge on factory automation SEMI Standards, Smart Manufacturing, and cybersecurity.
SEMIEXPO Heartland
April 1-2, 2025 | Indiana Convention Center | Indianapolis, IN
The first-ever SEMIEXPO Heartland brings together members of the Smart Manufacturing and Smart Mobility markets for two days of keynotes, presentations, sessions, networking, and more. Doug Suerich, Director of Marketing at PEER Group, will present on the topic of cybersecurity during the Smart Manufacturing sessions on Wednesday, April 2 from 3:20 p.m. – 3:45 p.m.
Doug Suerich
Director of Marketing, PEER Group
Industry Strategy Symposium Europe (ISS Europe)
March 12-14, 2025 | Sopot, Poland
PEER Group’s Managing Director for Europe, Michael Arnold, is attending this year’s SEMI Industry Strategy Symposium Europe (ISS Europe). The symposium will explore how AI is reshaping economic, technological, and market dynamics within the semiconductor industry. Experts will examine AI-driven innovation, efficiency improvements, and the balance between collaboration and competition in fostering Europe’s leadership in the global semiconductor market.
Michael Arnold
Managing Director for Europe, PEER Group
SEMI — Fab Owners Alliance (FOA) Q1
February 26-27, 2025 | Litchfield Park | Phoenix, USA
PEER Group and Polar Semiconductor are co-presenting a case study during the SEMI® Fab Owners Alliance (FOA) Collaborative Forum.
SEMICON Japan – Booth 5303
December 11-13 | Tokyo Big Sight | Tokyo, Japan
Stop by the Mizuho booth to ask the team about:
- SECS/GEM, GEM300, and Interface A / EDA
- SEMI Standards compliance
- Factory and tool automation and connectivity
- Test apps and factory acceptance
PEER Group’s Senior Standards Specialist, Albert Fuchigami, is participating in the inaugural SEMI Global Standards Summit, taking place during SEMICON Japan.
Albert Fuchigami
Senior Standards Specialist, PEER Group
SEMICON Europa – Booth C1265
November 12-15 | Messe München | Munich, Germany
CHIPS Month Canada
October 7 – November 7 | Across Canada
The first edition of CHIPS Month Canada will take place October 7 to November 7, 2024, at various locations across Canada.
EuroPAT Workshop 2024
September 9-10 | Berlin, Germany
PEER Group is a proud sponsor of this year’s edition of the EuroPAT Workshop. Presented by SEMI® Europe, EuraPAT brings together leading packaging, assembly, and test experts for two days of presentations on the latest supply chain trends influencing the European semiconductor industry.
PEER Group GmbH Managing Director, Michael Arnold, will present on how scenario testing can be used to accelerate equipment integrations into the manufacturing environment.
Michael Arnold
Managing Director, PEER Group GmbH
SEMICON Taiwan – Booth M0938
September 4-6 | TaiNEX | Taipei, Taiwan
SEMICON West – Booth 339
July 9-11 | Moscone Center | San Francisco, USA
Advanced Semiconductor Manufacturing Conference (ASMC)
May 13-16 | Hilton Albany | New York, USA
PEER Group is excited to attend the upcoming ASMC at a new location in Albany.
ASMC brings together semiconductor manufacturers, suppliers, and academia to discuss and solve major challenges facing advanced manufacturing.
European Advanced Process Control and Manufacturing (apc|m) Conference
April 16-18 | CinemaxX Hamburg | Hamburg, Germany
We’re proud to sponsor and present on Cybersecurity (co-authored with Applied Materials) at the apc|m conference.
Webinar: Standardizing the Semiconductor Manufacturing Backend
3:00 – 4:00 p.m. PT, February 22
To succeed in Smart Manufacturing, equipment users and suppliers need to adapt to new requirements for collecting and sharing large volumes of data at very high speeds. The SEMI EDA / Interface A standards provide the framework and capability to meet these challenges.
During this webinar hosted by SEMI, Albert Fuchigami of PEER Group will provide an overview of this standards suite and what attributes make it a good fit for modern data collection.
Albert Fuchigami, PEER Group Inc.
SEMICON Korea – Booth A434
January 31 – February 2 | COEX | Seoul, South Korea
We’re thrilled to be returning to Seoul for SEMICON Korea and look forward to connecting with you at the show! Come visit Bob Kane and Jay Ka at booth A434 to learn how our industry-leading test solutions can help you pass the factory acceptance test.
PEER Group test applications provide a robust and thorough way to make sure your tool or factory complies with SECS/GEM and GEM300 SEMI Standards.
SEMICON Japan – Booth 6914
December 13-15, 2023 | Tokyo Big Sight | Tokyo, Japan
PEER Group’s Japanese distributor, Mizuho Research and Technologies, is exhibiting at SEMICON Japan. Visit the Mizuho team at booth 6914 where they will be highlighting PEER Group’s range of SECS/GEM and SEMI Standards test products as well as our industry-leading automation and connectivity solutions.
SEMICON Japan Cybersecurity Forum
Doug Suerich, PEER Group’s Director of Marketing and Co-Chair of the recently formed SEMI Manufacturing Cybersecurity Consortium, will be at the show attending the SEMICON Japan Cybersecurity Forum on December 15. Featuring keynote addresses from Intel and TSMC, the Cybersecurity Forum will provide an overview of SEMI cybersecurity Standards E187 and E188 and what the industry is doing to defend the entire supply chain against the increasing threat of cyber attacks.
Smart Manufacturing Americas Chapter monthly meeting
December 7, 2023 | SEMI Headquarter | Milpitas, CA and Remote
Albert Fuchigami, Senior Software Developer at PEER Group, will provide a special spotlight presentation during the SEMI Smart Manufacturing Americas Chapter’s December meeting. Albert will share an update on work being done by the Equipment Data Publication (EDP) and Equipment Edge Data Governance (EEDG) Task Forces to define shareable and non-shareable data so all parties have the same expectation on what data is accessible from manufacturing equipment, and how this work may impact activities currently underway by various Global Smart Manufacturing Groups.
SEMI Cybersecurity Launch Workshop (Hybrid)
December 6-7, 2023 | Intel – SC12 | Santa Clara, USA
Hosted by the SEMI Cybersecurity Consortium, this free, two-day hybrid workshop is aimed at developing and advocating a practical, standards-based, industry-wide approach to improving cybersecurity and resilience across the semiconductor supply chain.
The 2023 Canadian Semiconductor Symposium
November 23-24, 2023 | Ottawa, Canada
Presented by CMC Microsystems, the 2023 Canadian Semiconductor Symposium (CSS) will showcase featured speakers from across Canada’s semiconductor ecosystem, including researchers, business leaders, and entrepreneurs. Programming will provide a portrait of where the Canadian semiconductor ecosystem is now and where it can be in the future.
Doug Suerich will be in attendance and is looking forward to connecting with other attendees.
SEMICON Europa – Booth B1454
November 14-17, 2023 | Messe München | Munich, Germany
Advanced Process Control Smart Manufacturing Conference (APCSM) 2023
October 9-12, 2023 | Austin, Texas
We presented on cybersecurity at APCSM 2023.
SEMICON Taiwan – Booth K2585
September 6-8, 2023 | TaiNEX | Taipei, Taiwan
SEMICON West – Booth 451, South Hall
July 11-13, 2023 | Moscone Center | San Francisco, USA
Webinar: Standardizing the Assembly and Test Process
June 22, 2023 | 1 p.m. ET / 11 a.m. MT
The webinar will feature an in-depth discussion between PEER Group’s Director of Marketing, Doug Suerich and Jason Cicero, Senior IT Domain Architect at Micron Technology®.
Topics covered will include: why the backend, including assembly and test, needs more automation and standardization, how this will impact equipment design and integration, common issues faced by factories when integrating new tools, and how equipment suppliers can help solve these issues. There will also be a live Q&A for attendees to ask questions during the webinar.
Advanced Semiconductor Manufacturing Conference (ASMC)
May 1-4, 2023 | The Saratoga Hilton | New York, USA
The PEER Group team is excited to attend this year’s ASMC. If you’re planning to be in Saratoga Springs and want to chat factory or tool automation, connectivity, and the latest in cybersecurity standards, be sure to contact us to set up a meeting.
European Advanced Process Control and Manufacturing (apc|m) Conference
March 28 – 30, 2023 | BMCC| Bruges, Belgium
U of T Talk: From Lab to Fab. Challenges in high volume production of VLSI circuits
March 21, 2023 | University of Toronto | Toronto, Canada
The Faculty of Applied Science and Engineering at the University of Toronto has invited PEER Group’s Director of Marketing, Doug Suerich, to speak with third- and fourth-year engineering students about semiconductor manufacturing.
Doug’s talk, From Lab to Fab. Challenges in high volume production of VLSI circuits, will provide insight into the complexity and challenges that are faced by semiconductor fabs in manufacturing more than 3 billion chips globally each day.
SEMICON Korea – Booth A836
February 1-3, 2023 | COEX | Seoul, South Korea
SEMICON Europa – Booth C1554
November 15-18, 2022 | Messe München | München, Germany
SEMI Global Smart Manufacturing Conference (GSMC) 2022 – Virtual
November 8-10, 2022 | Virtual
PEER Group is pleased to be moderating and presenting at the upcoming GSMC 2022.
Presentation: End-to-End Smart Manufacturing – Using EDA to Advance the Backend
- Doug Suerich, Director of Marketing & Product Evangelist, PEER Group
- 8:05 a.m. PT, Tuesday, November 8
This presentation will discuss, based on 30 years of experience and best practices learned from automating frontend tools and factories, how EDA / Interface A is the optimal framework to enable smart manufacturing in backend processes. With the impending release of EDA Freeze 3 and introduction of new protocols such as gRPC and HTTP/2, the high-speed data transfer provided by EDA will give backend manufacturers a massive capacity to collect, share and, analyze data. This will allow them to take full advantage of the smart manufacturing techniques that exist today to not only increase throughput, but also introduce labor saving automation capabilities. Furthermore, adopting EDA / Interface A in the backend ensures factories are able to take advantage of emerging technologies, such as machine learning and artificial intelligence, as they become more commonplace in semiconductor manufacturing.
Moderator
- Michael Arnold, Managing Director, PEER Group GmbH
- Session 1, Tuesday, November 8
Advanced Process Control Smart Manufacturing Conference (APCSM)
October 10-13, 2022 | Austin Airport Hilton Hotel | Austin, USA
SEMICON Taiwan – 展位 (Booth) J3050
September 14-16, 2022 | TaiNEX 1 | Taipei, Taiwan
SEMICON West – Booth 435, South Hall
July 12-14, 2022 | Moscone Center | San Francisco, USA
Presentation: Tool-Connected Web UIs to Enable Smart Manufacturing
Want to learn more about the advantages of deploying a web UI into semiconductor manufacturing? As part of the Smart Manufacturing Pavilion, PEER Group’s Director of Marketing, Doug Suerich, presented: Tool-Connected Web UIs to Enable Smart Manufacturing.
In this session, Doug demonstrated, using different manufacturing use cases, how factories, equipment makers, and operators can benefit from the implementation of web UI into their workflow.
Webinar – gRPC: What You Need to Know
May 17 | 10:00 a.m. PT, 1:00 p.m. ET
A major upgrade to tool data collection is coming to semiconductor factories. As the volume of data demanded by fabs exceeds the capabilities of traditional transmission protocols, experts are looking to gRPC as the likely replacement to achieve greater data throughput and faster, easier integration across the entire semiconductor automation stack.
Combining best practices from the world’s largest data producers and consumers with decades of semiconductor standards know-how, the deployment of gRPC into the factory heralds a new era of smart manufacturing.
In this webinar, you will learn:
- What is gRPC and why it’s important
- Where gRPC fits into existing factory automation communication landscapes
- How gRPC interacts with EDA / Interface A and the impact it will have on other SEMI Standards such as SECS/GEM and GEM300
- How to future-proof your software in preparation for the transition to gRPC
Factories will soon be demanding gRPC to feed their insatiable appetite for big data and smooth interoperability. Join us to learn from SEMI Standards experts about this exciting new technology, and how it will impact your software plans.
About the presenters
Doug Suerich, P.Eng; Director of Marketing
Doug combines more than 20 years of experience creating manufacturing software with a deep desire to help customers find the best solutions to solve their biggest challenges. A passionate advocate for smart manufacturing, Doug is an active member of the SEMI SMART Manufacturing Technology Community, Americas Chapter, and co-chairs the Advanced Process Control Smart Manufacturing Conference.
Albert Fuchigami, SEMI Standards Technical Committee Member
Albert is heavily involved in the SEMI Standards Program in North America, Japan, South Korea, Taiwan, and China. In addition to co-chairing the NA DDA Task Force, Fuchigami has authored various SEMI articles and tech briefs and is a frequent presenter at various SEMI events where he shares his knowledge and expertise on SEMI Standards.
Advanced Semiconductor Manufacturing Conference 2022
May 2-5, 2022 | The Saratoga Hilton| Saratoga Springs, NY
PEER Group is excited to be returning to Saratoga Springs to take part in this year’s Advanced Semiconductor Manufacturing Conference (ASMC) where we’ll be presenting our latest research into using artificial intelligence for real time cluster tool scheduling.
ASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Technical presentations at ASMC highlight industry innovations with specific results.
PEER Group presented the following:
Artificial Intelligence for Real Time Cluster Tool Scheduling
Date/Time: Tuesday, May 3, 1:55 p.m. ET
Authors: Doug Suerich, Trevor McIlroy
Presenter: Doug Suerich, Product Evangelist
Presentation overview
Complex semiconductor cluster tools present a difficult scheduling challenge where process-specific requirements must be balanced against the need to achieve maximum wafer throughput in a fault-tolerant manner. Building on previously presented machine-learning research, this presentation investigates the potential of introducing a tool-side AI-based scheduler that is capable of functioning in a high-mix environment while learning over time, reducing the amount of human engineering required to produce a high-quality schedule.
Advanced Process Control and Manufacturing (apc|m) Conference 2022
April 4-6, 2022 | Palais des Congrès Neptune| Toulon, France
PEER Group is a proud sponsor of this year’s Advanced Process Control and Manufacturing (apc|m) conference. Taking place over three days in Toulon, France, the conference features oral and poster presentations covering the latest innovations in advanced process control and manufacturing for the semiconductor and photovoltaic industries.
PEER Group presented the following:
Artificial Intelligence for Real Time Cluster Tool Scheduling
Date/Time: Tuesday, April 5, 10:45 CET
Presenter: Doug Suerich, Product Evangelist
Presentation overview
Semiconductor cluster tools present a complex scheduling challenge where process-specific requirements must be balanced against the need to achieve maximum wafer throughput in a fault-tolerant manner. Building on previously presented machine-learning research, this presentation investigates the potential of introducing a tool-side AI-based scheduler that is capable of functioning in a high-mix environment while learning over time, reducing the amount of human engineering required to produce a high-quality schedule.
SEMICON Korea – Booth C248
February 9-11, 2022 | COEX | Seoul, Korea
Stop by the PEER Group booth (C248) to discover how our industry-leading smart factory automation software can help your semiconductor tool or factory become SEMI® Standards compliant. Representatives from our Korean sales partner, Toward Future Inc., will be onsite and ready to help.
What’s new
- PFSC™, the industry’s best-in-class station controller solution, now features support for the rapid implementation of 300mm standards-compliant equipment, including backend tools, into factories.
Webinar: The UI and UX of Automation, presented by A3
12:00 pm – 1:00 pm ET, January 18, 2022
The Association for Advancing Automation (A3) is hosting a panel discussion on The UI and UX of Automation, featuring UX expert Karanvir Kang, one of PEER Group’s Software Development Managers.
Moderated by Clarissa Carvalho, Content Marketing Manager at A3, the discussion will take a deep dive into the best methods for success in designing user interfaces that engage, inform, and employ best practices. Topics covered will include:
- Methods for planning the user experience
- How to engage with process experts, operators, health and safety
- How to keep automation simple and straightforward in a complex manufacturing environment
SEMICON Taiwan – Booth K2868, 1F
December 28 – 30, 2021 |Taipei Nangang Exhibition Center | Taipei, Taiwan
Meet with our local product distributors – DKSH Taiwan Ltd. – in our booth.
“Backend equipment and the need for SECS/GEM and GEM300” – pre-recorded presentation
Presenter: Doug Suerich, Director of Marketing
演講人：Doug Suerich, PEER Group 營銷總監
Q&A: Robert Wang, Senior Sales Manager, DKSH Taiwan
問答環節：王騰儀, DKSH台湾区資深業務經理
Smart Manufacturing Journey, Meet the Experts Theatre, Booth #K3260, 1F (TaiNEX 1)
高科技智慧製造未來展區，專家開講，南港展覽館1館1F (Booth #K3260)
13:10 – 13:30, Tuesday (星期二), December 28
SEMICON West – Booth 461, South Hall
December 7 – 9, 2021 | Moscone Center | San Francisco, USA
Be sure to stop by Booth 461 – South Hall at SEMICON West to say “Hi” to the PEER Group® Team and learn about the latest features we’ve added to PEER® Tool Orchestrator (PTO®).
What’s new?
- PTO & Machine Learning – The latest version of PTO introduces new infrastructure for machine learning, making it easier than ever to predict job completion. Request this webinar to learn more about machine learning and automation.
- Remote Access – PTO’s all-new Web UI gives users remote access to the PTO server from virtually any smart device. Overcome clean room logistical challenges, decrease response time, increase productivity, and introduce new manufacturing efficiencies into your process.
Smart Manufacturing Pavilion
Doug Suerich, PEER Group’s Director of Marketing and Product Evangelist, is chairing all 4 sessions focused on optimizing manufacturing. These sessions are a great opportunity to learn about the latest advancements in Smart Manufacturing.
| Session | Date | Time |
|---|---|---|
| Sensing the Smart Way | Tuesday, December 7 | 10:30am – 12:30pm |
| Connecting the Smart Way | Tuesday, December 7 | 2:00pm – 4:00pm |
| Predicting the Smart Way | Wednesday, December 8 | 10:30am – 12:30pm |
| Smart Solutions with Real Benefits | Wednesday, December 8 | 2:00pm – 4:00pm |
SEMICON Europa – Booth B1634
November 16 – 19, 2021 | Messe München | München, Germany
“Can AI Optimize Your Equipment’s Throughput” – Presentation
Presenter: Mike Barrett, Director, Global OEM Sales
Executive Forum, Hall B2
16:10 CET | Wednesday, November 17, 2021
In response to global chip shortages, many semiconductor fabs have started to demand even higher throughput from the equipment on their manufacturing floors. While process timing is often constrained by physics, opportunities do exist to reduce wait time waste by optimizing the manner in which substrates are scheduled within complex tools, for example, in equipment that combines multiple operations within a single cluster.
However, scheduling wafer flows within a complex cluster tool – particularly in a high-volume, high-mix environment – presents several engineering challenges for optimizing wafer movements. Is it possible to avoid deadlocks and maximize throughput while enforcing strict process and recipe rules? When a tool’s components are operating in a degraded mode or are disabled for maintenance, can the equipment continue to perform efficiently? A tight labor market that requires OEMs to make tough decisions about where to allocate scarce expert developers compounds the challenge.
Advances in artificial intelligence (AI) and machine learning have introduced the possibility for automated solutions that can discover optimal routing in real time, replacing the effort for creating high-quality substrate schedulers manually. Such an approach would increase fab throughput while simultaneously reducing time to market and engineering effort for OEMs.
In this talk, PEER Group will compare three generations of cluster tool schedulers: Traditional, Offline optimized via machine learning, and Real-time equipment optimization using AI.
WEBINAR: Backend equipment and the need for SECS/GEM & GEM300
October 26, 2021
As factories look to streamline their production, increase quality, and reduce costs, best practices from highly automated front end fabs are making their way into the back end. OEMs are being asked to deliver equipment that is compliant with SEMI® Standards such as SECS/GEM, GEM300 and more.
In this webinar, you will learn:
- The basics around the primary SEMI automation standards, and where they are being used
- How you can implement the standards to make your equipment compliant
- The common pitfalls during factory acceptance testing, and how you can avoid them to get equipment accepted on time
Achieving SEMI Standards compliance is increasingly important for OEMs but it does not need to be complicated.
SEMI Global Smart Manufacturing Conference – Virtual
October 19 – 22, 2021
Session Moderator: Doug Suerich, Director of Marketing
PEER Group is pleased to sponsor this Smart Manufacturing event.
APCSM Conference 2021 – Virtual
October 4 – 7, 2021
Co-chair: Doug Suerich, Director of Marketing
PEER Group is pleased to sponsor the APCSM Hybrid conference.
European Advanced Process Control and Manufacturing (apc |m) Conference – Virtual
April 13 – 14, 2021
“Machine Learning for Cluster Tool Throughput Optimization” – Presentation
Presenter: Doug Suerich, Product Evangelist
10:45am – 12:00pm, Wednesday, April 14, 2021
SEMI Europe Technology Week Webinar Series
March 25, 2021
Future Fab Day – The World of Smart Manufacturing
Moderator: Michael Arnold, Managing Director, PEER Group GmbH
SEMICON China – Booth 3214, N3
March 17 – 19, 2021 | Shanghai New International Expo Centre | Shanghai, China
Meet with our local product distributors – DKSH (Shanghai) Ltd. – in our booth.
Technology Unites Global Summit – Virtual
February 15 – 19, 2021
“Cost-effective Automation for Legacy Factories” – Presentation
Presenter: Doug Suerich, Product Evangelist
Fab Management Forum Session 2: Smart Fab Solutions for Smarter Process Tools
12:00 – 14:15 CET | Wednesday, February 17, 2021
SEMICON Japan – Virtual
December 16 – 18, 2020
Visit Mizuho’s virtual booth
Schedule some time to meet with our Japanese product distributors, Mizuho, about our factory automation software solutions.
sales.jp@peergroup.com
(+81)-3-5978-7162
SEMI Webinar: European Collaborations Driving Smart Manufacturing Excellence
December 9, 2020
4:00 – 5:30 p.m. CET
“SEMI Smart Manufacturing Technology Community – Europe Chapter” – Presentation
Michael Arnold, Managing Director, PEER Group GmbH
4:45 – 5:00 p.m. CET
Fab Owners Alliance (FOA) Q4 Virtual Conference
December 1 – 3, 2020
Visit us at our Virtual Tabletop
Webinar: EDA Data Collection in Semiconductor Manufacturing: Why and How
November 10, 2020
Following the success of our EDA webinar timed for audiences in Asia, we’re presenting the same topic again — this time, for audiences in North America and Europe.
On November 10, join us to learn best practices for:
- Enabling your factory or equipment to support EDA, Interface A
- Ensuring your automation software is optimized to manage Big Data
- Preparing to take advantage of SEMI’s EDA Freeze 3, designed for faster data collection
As the demand for data grows across the semiconductor industry, smart factories and OEMs are adopting Equipment Data Acquisition (EDA, Interface A) because they know that more data leads to deeper insight into critical processes. But, EDA does not have to be complicated.
Learn how to implement EDA quickly and easily.
SEMI Global Smart Manufacturing Conference – Virtual
October 20 – 23, 2020
PEER Group is pleased to sponsor this Smart Manufacturing event.
APCSM Conference XXXII 2020 – Virtual
October 4 – 7, 2021
“Cost-effective Data Collection for Legacy Factories” – Presentation
Presenter: Doug Suerich, Product Evangelist
4:30 p.m., Tuesday, October 6, 2020
PEER Group is pleased to sponsor the APCSM Virtual Conference.
SEMICON Taiwan – Booth K2964, 1F
September 23 – 25, 2020 | Taipei Nangang Exhibition Center | Taipei, Taiwan
Meet with our local product distributors – DKSH Taiwan Ltd. – in our booth.
Meet with our local product distributors – DKSH Taiwan Ltd. – in our booth.
Robert Wang, Senior Sales Manager, DKSH Taiwan (王騰儀, 資深業務經理)
Smart Manufacturing Journey, Meet the Experts Theatre (高科技智慧製造未來展區, 專家開講)
Booth J3146, 1F, TaiNeX 1 (南港展覽館一館1F)
1:30 – 1:50 p.m., Wednesday, September 23, 2020
Webinar: EDA Data Collection in Semiconductor Manufacturing: Why and How
September 17, 2020
As the demand for data grows across the semiconductor industry, smart factories and OEMs are adopting Equipment Data Acquisition (EDA, Interface A) because they know that more data leads to deeper insight into critical processes.
In this webinar, you will learn best practices for:
Enabling your factory or equipment to support EDA, Interface A
Ensuring your automation software is optimized to manage Big Data
Preparing to take advantage of SEMI’s EDA Freeze 3, designed for faster data collection
EDA does not have to be complicated. Join us to learn how to implement EDA quickly and easily.
Advanced Semiconductor Manufacturing Conference (ASMC) – Virtual
Week of August 24, 2020
“Reinforcement Learning for Efficient Scheduling in Complex Semiconductor Equipment” – Presentation
Presenter: Doug Suerich, Product Evangelist
Co-Author: Terry Young, Technology Researcher
Smart Manufacturing Session (On-Demand Video Presentation)
SEMICON West – Virtual
July 21 – 23, 2020
We’ve missed connecting with you in person this year so we’re excited about Virtual SEMICON West. The digital trade show will provide different ways for us to catch up.
Visit our virtual booth
Our team will be on-hand during show hours. Drop by our virtual booth to chat about our advanced factory automation software solutions that will help you achieve your Smart Manufacturing goals.
Schedule some time with us
To ensure our calendars line up, we encourage you to contact us ahead of time to schedule your meeting.
Join us in the Smart Manufacturing Pavilion
On Tuesday, July 21, Doug Suerich will moderate the talks in the virtual Smart Manufacturing Pavilion. Join him to hear about breakthroughs in Big Data, AI, analytics, and more.
“See” you there!
We hope to catch up with you at the show.
SEMICON China – Booth 7663, Hall E7
June 27-29, 2020 | Shanghai New International Expo Centre | Shanghai, China
Webinar: Machine Learning for Improved Scheduling and Throughput in Semiconductor Equipment
May 12, 2020
SEMICON Japan – Booth 3355, West Hall 2
December 11 – 13, 2019 | Tokyo Big Sight | Tokyo, Japan
SEMICON Europa – Booth B1744
November 12 – 15, 2019 | Messe München | Munich, Germany
“Smart Manufacturing I (Software-centric)” – Session Chair
Michael Arnold, Managing Director, PEER Group GmbH
TechARENA 1, Hall B1
Wednesday, November 13, 2019
11:30 – 13:30
“Simplifying your tool automation” – Presenter
Doug Suerich, Product Evangelist
TechLounge, Hall B2
Wednesday, November 13, 2019
10:00 – 10:15
Fabs are under continuous pressure to increase throughput, maximize yield, and reduce costs. These demands produce demanding equipment purchase specifications and place strict requirements on OEMs to provide more advanced automation and data management capabilities. Additionally, these requirements create an increasing burden on OEMs to provide best-in-class automation software to complement their process expertise. The best OEMs are making strategic decisions to ensure they can meet these factory needs efficiently today and in the future.Join us as we discuss how you can streamline the delivery of your tool automation, allowing your engineers to focus on your core capabilities, while ensuring rapid deployment of SEMI standards-compliant equipment automation software, enabling fast fab acceptance of your tools.
“Practical machine learning for tools” – Presenter
Doug Suerich, Product Evangelist
Smart Manufacturing II (hardware-centric)
TechARENA 2, Hall B1
Thursday, November 14, 2019
13:55 – 14:25
Semiconductor equipment makers (OEMs) are under pressure to produce tools that offer the maximum possible substrate throughput while maintaining high process quality levels. Although actual processing time is often constrained by physical limits based on the underlying requirements of the process itself, overall throughput in a tool is also subject to non-productive time delays such as transfer time, equipment speed limitations, and vacuum pump down. Therefore, minimizing non-productive tool time is a key element in maximizing overall throughput.This case study investigates efforts made to use machine learning to improve throughput in a complex cluster tool. Traditional methods to find planner optimizations were successful, but required extensive amounts of non-recurring engineering expense. This led to an exploration of how modern machine learning algorithms could be used to streamline the planner optimization process and find solutions beyond what a human engineer could discover.
Advanced Process Control (APC) Conference – Tutorial Instructor and Sponsor
October 28-31, 2019 | Embassy Suites Riverwalk Hotel | San Antonio, Texas
“Learning to Share: Securing data access in a paranoid industry”
Co-instructors Doug Suerich, Product Evangelist & Karanvir Kang, Software Development Manager
Monday, October 28, 2019
Morning tutorial 8:00am – 12:00pm
Data lies at the very heart of APC, driving improvements across the entire manufacturing process and supply chain. Data enables run-to-run (R2R) control, fault detection and classification (FDC) and much more, including newer Smart Manufacturing initiatives like machine learning and artificial intelligence.
Access to data, both historical and real-time, is an absolute requirement before any APC efforts can even begin. However, secure data access is a serious challenge in the semiconductor industry. Many OEMs are unwilling to share data that could reveal their process secrets to other tool makers or their end customers. Fabs are reluctant to share information that could leak out to their competitors. Even fab customers have strict requirements around secrecy: no one wants an upcoming product feature to leak ahead of a planned release date.
Given these constraints to data sharing and data security, how can progress be made? How can we share data with those who need it, while protecting that same data from those who should not have access to it? In this tutorial, we will present the basics of secure data access, covering the concerns and solutions at a holistic level by considering the technologies, processes, standards, and best practices both from within semiconductor manufacturing and from other industries. In addition to examining the current state of the industry, we will look at future trends and upcoming possibilities that could be unlocked through access to more data.
This tutorial is structured so that all data users — from novices to experts — will benefit from a deeper understanding of how to protect the data you are already using, and how to better negotiate safe and secure access to data that might not be shared otherwise.
SEMICON Taiwan – Booth K3161, 1F
September 18 – 20, 2019 | Taipei Nangang Exhibition Center | Taipei, Taiwan
“Accelerate your manufacturing with smart factory automation” – Presentation
Doug Suerich, Product Evangelist
Booth J3258, 1F, Smart Manufacturing Journey
Wednesday, September 18, 2019
13:30-13:50
SEMI Smart Manufacturing Workshop – Premium Sponsor and Presenter
September 12, 2019 | SEMI Global Headquarters | Milpitas, California
“Can we talk? Next-gen communication for Smart Manufacturing”
Doug Suerich, Product Evangelist
Communication Protocols and Best Practices Session
Thursday, September 12, 2019
1:40pm – 2:05pm
eManufacturing & Design Collaboration Symposium (eMDC) – Sponsor
September 6, 2019 | The Ambassador Hotel Hsinchu | Hsinchu City, Taiwan
SEMICON West – Booth 661, South Hall
July 9 – 11, 2019 | Moscone Center | San Francisco, USA
Panel – Securing the Foundation: Building a Trusted Silicon Supply Chain
Doug Suerich, Product Evangelist
TechTALKS Stage South
Tuesday, July 9, 2019
11:25am – 12:25pm
Doug and fellow panel members will be discussing critical components to build a secure global supply chain for chip manufacturing.
Silicon Saxony Day
June 18, 2019 | Dresden International Airport | Dresden, Germany
Smart Automation Expert Session – Session Chair
Michael Arnold, Managing Director, PEER Group GmbH
10:00 – 12:00
Silicon Alps: Digital Dialog Day – Presentation
May 28, 2019 | Silicon Alps Cluster GmbH | Villach, Austria
Machine connectivity: The rocky road to conformance of factory requirements
Michael Arnold, Managing Director, PEER Group GmbH
Advanced Semiconductor Manufacturing Conference (ASMC)
May 6 – 9, 2019 | Saratoga Hilton City Center | Saratoga Springs, New York
“Machine learning for optimized scheduling in complex semiconductor equipment” – Poster session
Doug Suerich, Product Evangelist
Semiconductor cluster tools add an integral component to the modern semiconductor manufacturing process. These complex tools provide a flexible deployment option to group multiple processing steps into a single piece of equipment, allowing for more efficient processing. They also contribute to a reduction in the number of times a wafer must go through the atmospheric-vacuum-atmospheric cycle. These highly automated tools present a complex scheduling challenge where process-specific requirements are balanced against a need to achieve maximum wafer throughput in a fault-tolerant manner. Software engineers typically build schedulers using a set of manually-configured heuristics but this can be a labor-intensive process where small changes to the cluster configuration or process requirements can require large changes to the scheduler. Our motivation for this work was to investigate whether a machine learning approach to complex scheduling could be developed more efficiently and at a lower cost than existing methods.
Advanced Process Control and Manufacturing (apc|m) Conference
April 8 – 10, 2019 | Congress Center Villach | Villach, Austria
“Cybersecurity for OEMs: protecting equipment against cyber threats” – Presentation
Doug Suerich, Product Evangelist
Wednesday, April 10, 2019
11:00 – 13:00
Highly-automated semiconductor manufacturing relies on machine-to-machine (M2M) and machine-to-host connectivity. But, this introduces a security risk for both equipment makers and factories. A virus on a single tool could cause costly factory-wide downtime and fabs are beginning to demand that OEMs plan for long-term OS maintenance and updates to their products. OEMs are under pressure to find economical methodologies to meet these demands for entire fleets of tools. We’ll introduce a cost-efficient process for maintaining security on a tool over a multi-decade lifespan, as well as an updated philosophy for long-term tool maintenance permitting OEMs to provide the level of ongoing support demanded by fabs.
SEMICON China – Booth 7139, E7
March 20 – 22, 2019 | Shanghai New International Expo Centre | Shanghai, China
“Managing Big Data for Smart Manufacturing” – Presentation
Doug Suerich, Product Evangelist
Smart Manufacturing Forum
New Tech Stage, Hall E7
Thursday, March 21, 2019
15:35 – 16:05
Big data management provides big opportunities for OEMs. All semiconductor OEMs understand the importance of data: it drives manufacturing improvements (e.g., tells you where and when to add more sensors, how to perform faster sampling, and how to integrate different sources). Collecting large data volumes (e.g., EDA data) enables deep insight into critical manufacturing process and production metrics, and opens the possibility of using advanced analytics and machine learning to speed defect analysis and reduce repair times. Join us to learn how standards-based data management solutions will enable high-speed data collection and storage, and how you can leverage best practices to take advantage of Smart Manufacturing opportunities quickly and inexpensively.
Learn how we can help you store 10x more data, 450x faster than with a SQL database, and use only 1/10th the database size. Typical database solutions cannot handle your big data demands. Our connectivity solutions do. We leverage time-series data collection for data that is collected sequentially (e.g., from processing equipment and sensors at time intervals). The result: significantly faster and more efficient data collection, storage and retrieval.
“Fast, Efficient EDA Data Collection, Storage and Retrieval” – Presentation
Doug Suerich, Product Evangelist
Presentations from PEER Group’s booth 7139, E7
Doug will present at these times:
Learn how we can help you store 10x more data, 450x faster than with a SQL database, and use only 1/10th the database size. Typical database solutions cannot handle your big data demands. Our connectivity solutions do. We leverage time-series data collection for data that is collected sequentially (e.g., from processing equipment and sensors at time intervals). The result: significantly faster and more efficient data collection, storage and retrieval.
SEMICON Korea – Booth 804, Hall C
January 23 – 25, 2019 | COEX | Seoul, Korea
“Single Device Tracking Taskforce Updates” – Presentation
Doug Suerich, Product Evangelist
Korea I&C Committee
Room 300, Conference Room (South)
Thursday, January 24, 2019
11:10 – 11:50
SEMICON Japan – Booth 3413, Hall 3
December 12-14, 2018 | Tokyo Big Sight | Tokyo, Japan
At SEMICON Japan, we co-exhibit with our Japanese distributor, Mizuho Information & Research
“Supply chain transparency to meet the future of productivity”
Doug Suerich, Product Evangelist
Traceability Workshop for IoT and Microelectronics Manufacturing Supply Chain
Conference room 607, Tokyo Big Sight
Wednesday, December 12, 2018
11:00 – 12:40
“HTTP/2 with gRPC and protocol buffers: leveraging new technology for better, more efficient data transfers”
Albert Fuchigami, Senior Software Developer
North America DDA Task Force Co-Chair
EDA Workshop
Conference Room 607, Tokyo Big Sight
Wednesday, December 12, 2018
14:00-17:00
“Cybersecurity for OEMs: protecting your tools against cyber threats”
Doug Suerich, Product Evangelist
TechSPOT INNOVATION & IoT
East Hall 3
Thursday, December 13, 2018
12:40 – 13:30
Semiconductor manufacturing relies on machine connectivity. But, this introduces a security risk for both equipment makers and factories. A virus on a single tool could cause costly factory-wide downtime. This talk explores the need for OEMs to set up an ongoing equipment maintenance strategy.
SEMI Smart Manufacturing Workshop – Session Leader, Presenter, Sponsor
November 28, 2018 | SEMI International Headquarters | Milpitas, CA
Join SEMI’s Smart Manufacturing Technology Community at this one-day workshop to discuss real-world use cases for Smart Manufacturing and how you can leverage it for better business results.
Doug Suerich will lead the Security breakout session – Access Data/Data Sharing, Data Policies – which will look at:
- Data management and policies for the different types, classes and levels of data generated in a Smart Manufacturing environment
- Data access and transfer protocols
- Existing and needed standards to raise security “comfort levels”
Doug will also present the latest IMA APC Council meeting results.
SEMICON Europa – Booth A4445, A4
November 13-16, 2018 | Messe München | Munich, Germany
“Helping OEMs scale up to big data volumes”
Mike Barrett, Director, Global OEM Sales
TechLOUNGE Hall A4
Wednesday, November 14, 2018
12:00
The market is demanding faster throughput, smaller feature sizes and higher quality. Data is the fuel that drives these improvements – from more sensors to faster sampling and greater integration of different sources. Collecting larger data volumes allows for deeper insight into critical process and production metrics and provides the possibility of using advanced analytics and machine learning to speed defect analysis and reduce repair times. However, this explosion of big data can overwhelm traditional data sharing and storage mechanisms. Join us as we discuss cutting edge approaches to managing your data including new storage solutions, best practices for where your data should live and methods for sharing that data with your analysis systems and global experts.
“Smart Manufacturing”
Session Chair: Michael Arnold, Managing Director, PEER Group GmbH
TechARENA 1, Hall A4
Wednesday, November 14, 2018
11:45 – 13:50
http://www.semiconeuropa.org/show-floor-techarena#5
“Cybersecurity for factories and tools: protecting yourself against potential threats”
Doug Suerich, Product Evangelist
TechARENA 1, Hall A4
Wednesday, November 14, 2018
13:25
Highly-automated semiconductor manufacturing relies on machine-to-machine (M2M) and machine-to-host connectivity. But, this introduces a security risk for both equipment makers and factories. A virus on a single tool could cause costly factory-wide downtime. Forward-thinking OEMs are wondering whether they have protected their equipment adequately against potential cyber threats. Forward-thinking factories are considering all of the equipment on their manufacturing floors to ensure they stay risk free. This talk explores the need for OEMs to set up an ongoing equipment maintenance strategy that takes into consideration several important steps: upgrading all tools to modern-day operating systems that enable virus scanning, installing new connectivity software products to support new technologies and new factory requirements, and leveraging the secure remote connectivity to perform remote virus scans on all files moving into the factory, manage ongoing equipment maintenance activities to keep tools up to date, audit production tools to address software end of service (EOS) issues, and avoid causing factory-wide downtime by introducing a virus.
Advanced Process Control (APC) Conference – Presenter and Sponsor
October 8-11, 2018 | Airport Hilton Hotel | Austin, TX
“Building the road to Smart Manufacturing”
Doug Suerich, Product Evangelist
Tuesday, October 9, 2018
4:30pm
The International Roadmap for Devices and Systems (IRDS) maintains a 15-year technology roadmap covering many areas, including Smart Manufacturing and Industry 4.0, for the devices and systems industries. This talk introduces work currently underway by some SEMI® task forces and technical committees to update the SEMI standards in an effort to enable the vision proposed by the IRDS roadmap and move the state of the industry forward.
“Throughput optimization in sophisticated equipment”
Doug Suerich, Product Evangelist
Wednesday, October 10, 2018
11:30am
This talk presents a case study in which we investigated throughput optimization opportunities on a complex cluster tool and increased throughput by 13% using only software and configuration changes.
SEMICON Taiwan – Booth K2666, 1F
September 5-7, 2018 | Taipei Nangang Exhibition Center | Taipei, Taiwan
“Speed the way to Smart Manufacturing with standards-compliant factory automation software”
Mike Thiessen, Product Engineering Manager
Wednesday, September 5, 4:45pm
Smart Manufacturing Forum, 5F
Industry 4.0 promises revolutionary improvements in quality, throughput and speed to market. To support next-generation manufacturing initiatives, factory automation software systems need to be fault-tolerant, fast and reliable. However, the initial investment for Smart Manufacturing can seem like a barrier. This talk highlights how companies can leverage existing SEMI® standards to capture best practices and build on the learnings of others, helping you lower costs and deliver projects on time.
“Smart station controllers for Smart Manufacturing”
Mike Thiessen, Product Engineering Manager
Friday, September 7, 11:10am
TechXPOT, 1F
SEMICON West – Booth 1817, South Hall – Presenter
July 10-12, 2018 | Moscone Center | San Francisco, USA
“Architecting for agility: incorporating IIOT into your data collection”
Doug Suerich, Product Evangelist
Smart Manufacturing Pavilion, Meet the Experts Theater
Wednesday, July 11, 2018
10:30-11:00am
Equipment manufacturers are under pressure to reduce costs while maintaining or increasing quality and contributing to overall customer throughput. Increasingly, innovative end users are looking for big data solutions that will help them introduce extra efficiencies in their factories. While modern machine learning and artificial intelligence algorithms hold the promise of near-magical problem solving and fault detection capabilities, they have one major weakness: a voracious appetite for high volumes of data. These trends are increasing the demands on tool makers to provide even faster data collection and sensor data for variables that were not included in their original tool specifications. Meeting these demands from end customers requires the OEM to adopt an agile approach, where additional sensors and data collection plans can be deployed rapidly and customized on existing equipment platforms. The Industrial Internet of Things (IIoT) promises a solution to the hardware side of the problem (through the availability of cost-effective sensors, etc.) and capturing the data at the source, but this leaves unanswered questions around the best ways to share that data. The industry needs to consider equipment performance, security, stability, and long-term maintainability of the solution. Smart Manufacturing and data collection expert, Doug Suerich, discusses practical ways to meet these challenges without massive investment or diversion from existing SEMI Standards.
CPES2018 (Intelliflex) – Presenter
May 24, 2018 | Centennial College | Toronto, ON
“Moving towards High-Volume Manufacturing with standards”
Doug Suerich, Product Evangelist
10:00-10:15am
Doug will discuss moving toward high-volume FHE manufacturing with standards, by drawing on the lessons learned from the semiconductor industry to bridge the gap between prototyping and high-volume production.
Advanced Semiconductor Manufacturing Conference (ASMC) – Poster Presentation
April 30 – May 3, 2018 | Saratoga Springs, NY
Poster Presentation: “A systematic approach to secure data collection across an OEM’s fleet of tools”
Doug Suerich, Product Evangelist
Tuesday, May 1, 2018
5:15-6:45pm, Session 5
This paper discusses the approaches the PEER Group team took to design and implement a secure data management system to collect data from tools installed at fabs in different geographic locations and to move that data to a cloud-based storage system. The motivation for our work was to find the best way to match equipment performance across a global fleet of tools using modern analytics for predictive decision-making. However, gathering the data and feeding it into remote analytics software to perform fleet-wide comparisons presents familiar obstacles related to IP protection, the management of big data, and implementation risk. The majority of the effort in creating such a data collection system did not lie in the movement of the data, but rather in the systematic identification and assessment of objections to data sharing in a notoriously secretive industry. By explicitly addressing each of the concerns related to secure data sharing, PEER Group was able to create a system that allowed for limited collection of data in a means acceptable to all stakeholders.
APC|M Europe Conference – Presenter and Session Sponsor
April 16-18, 2018 | Dresden, Germany
“Secure Data Collection Across an OEM’s Fleet of Tools”
Doug Suerich, Product Evangelist
PEER Group sponsored the “Factory productivity and automation” session
SEMICON China – Booth 2785, N2
March 14-16 | Shanghai New International Expo Centre | Shanghai, China
Global Smart Manufacturing Summit – Presenter
February 21-23, 2018 | Marriott Hotel | Stuttgart, Germany
“CASE STUDY: Industry 4.0 – The Evolution of the Revolution”
Michael Arnold, Managing Director, PEER Group GmbH
Wednesday, February 21, 2018
15:05
Michael’s case study will highlight the characteristics and driving factors of the industrial revolutions. He will provide an assessment of where we are today, the leadership question, and factors for success.
2018FLEX – Presenter and Session Sponsor
February 12-15, 2018 | Hyatt Regency Monterey Hotel & Spa | Monterey, California
Agenda: http://www.semi.org/en/2018flex-agenda
“Moving towards high-volume manufacturing with standards”
Doug Suerich, Product Evangelist
Thursday, February 15, 2018
9:25-9:45am
PEER Group sponsored the “Standards and Reliability” session on February 15
Revolutionary advances in flexible electronics hold the promise of producing innovative new products at lower cost than traditional methods. However, the gap between prototype production and high-volume manufacturing (HVM) can be daunting. How can you ensure that you have the infrastructure in place to move your process from the laboratory to the complexities and uncertainties of real-world manufacturing, especially in a smart factory? Fortunately, lessons learned in the semiconductor manufacturing industry provide clear guidance for making the move towards full automation and standardized data collection and material handling.
This presentation reviews the fundamental requirements for making the transition from pilot process to implementation inside a modern production facility and value chain. We’ll discuss design patterns and standards for automation, big data collection and security that you can implement now to help simplify future sales to demanding customers. We’ll also introduce a path for taking your HVM to the next level: introducing essential concepts for realizing Smart Manufacturing and Industry 4.0. Modern analytics can be used to monitor a fleet of deployed equipment to find opportunities for improvement (e.g., enabling predictive maintenance to reduce unplanned equipment downtime). However, this can only work if the collected data is consolidated securely into a central location. The basic data collection infrastructure we recommend paves the way for a complete, secure remote connectivity and data sharing solution that provides equipment makers and manufacturers a powerful new and secure way to collaborate.
ACM Education – Presenter
Thursday, February 8, 2018 | FH Kärnten, Lakeside Park | Klagenfurt, Austria
“Automation Capability Management: Lessons Learned in the Semiconductor Industry”
Michael Arnold, Managing Director, PEER Group GmbH
17:00
SEMICON Korea – Booth 319, Hall D
January 31 – February 2, 2018 | COEX | Seoul, Korea
SEMICON Japan – Booth 3220, Hall 3
December 13-15, 2017
At SEMICON Japan, we co-exhibit with our Japanese distributor, Mizuho Information & Research
Tokyo Big Sight
Tokyo, Japan
SEMICON Japan – Presenter
Doug Suerich, Product Evangelist
“Using the cloud in a security-conscious industry”
Location: TechSPOT West
Date: Wednesday, December 13, 2017
Time: 13:40-14:30
Abstract:
Cloud computing promises new methods for process optimization. But, in an industry that is historically risk averse and security-conscious, many companies still hesitate to use the cloud. Our case study discusses how we leveraged the cloud’s speed, security, and cost advantages for data analytics.
SEMICON Europa – Booth 1428, B1
November 14-17, 2017
Co-located with productronica
Messe München
Munich, Germany
SEMICON Europa – Presenter
Doug Suerich, Product Evangelist
“Data collection strategies for Smart Manufacturing”
Location: TechLOUNGE, B1
Date: Wednesday, November 15
Time: 12:15
IT2Industry and Productronica – Presenter
Doug Suerich, Product Evangelist
“Incremental approaches to Smart Manufacturing”
Location: Open Conference Stage, B2
Date: Wednesday, November 15
Time: 11:00
Abstract
Advanced manufacturers operate under relentless pressure to reduce costs while maintaining and – in many cases – increasing quality and throughput. Smart Manufacturing provides a solution to these challenges by harnessing the power of big data and predictive analytics to streamline manufacturing processes and improve decision making. This discussion outlines two case studies that provide clear lessons learned from Smart Manufacturing implementations in the electronics and life sciences industries. An investigation into the Smart Manufacturing practices of the semiconductor industry highlights the role that standards can play in reducing the cost and time required to implement a Smart Manufacturing solution.
SEMICON Europa – Session Chair
Michael Arnold, Managing Director, PEER Group GmbH
Smart Manufacturing Session Chair
Location: TechARENA 1
Date: Thursday, November 16
Time: 10:00-12:30
Session agenda: http://semiconeuropa.org/techarena2017smartmanufacturingsession
Canadian Intelligent Manufacturing Technology Roadshow, Industrial Automation Mission to Greater China Region – Participant
October 18-27, 2017
Organized by the Ontario Ministry of International Trade in cooperation with the Canadian Trade Commissioner Service in China and Taipei
Canada-Taiwan Smart Manufacturing Forum – Presenter
October 18, 2017
Bill Schmalz, Vice-President, Sales
Taipai City, Taiwan
Bill Schmalz will present our vision for the future of Smart Manufacturing at this special forum
APC Conference XXIX 2017 – Presenter
October 9-12, 2017
Doug Suerich, Product Evangelist
“Multi-site data collection: enabling fleet analytics and comparative analysis across global deployments”
Austin Airport Hilton Hotel
Austin, Texas
SEMICON Taiwan – Booth 2834, 1F
September 13-15, 2017
Taipei Nangang Exhibition Center
Taipei, Taiwan
SEMICON Taiwan – Presenter
Doug Suerich, Product Evangelist
“Data collection strategies for Smart Manufacturing”
Location: TechXPOT 1F
Date: Wednesday, September 13, 2017
Time: 12:20
SEMICON West – Booth 5250, North Hall
July 11-13, 2017
Moscone Center
San Francisco, USA
Global fleet management solution for OEMs
- See our news release for more details
- Book your live software demo
Atlantic Design & Manufacturing – Presenter
Doug Suerich, Product Evangelist
“Case Study: Smart Manufacturing Lessons Learned in Electronics, Life Sciences, and Semiconductor Industries”
Smart Manufacturing Innovation Summit
Location: Jacob K. Javits Convention Center, New York, NY
Date: Tuesday, June 13, 2017
Time: 3:00-3:30pm
Abstract
Advanced manufacturers operate under relentless pressure to reduce costs while maintaining and – in many cases – increasing quality and throughput. Smart Manufacturing provides a solution to these challenges by harnessing the power of big data and predictive analytics to streamline manufacturing processes and improve decision making. This discussion outlines two case studies that provide clear lessons learned from Smart Manufacturing implementations in the electronics and life science industries. An investigation into the Smart Manufacturing practices of the semiconductor industry highlights the role that standards can play in reducing the cost and time required to implement a Smart Manufacturing solution.
ASMC 2017
May 15-18, 2017
Saratoga Hilton
Saratoga Springs, New York
APC|M conference
April 10-12, 2017
Gibson Hotel
Dublin, Ireland
SEMICON China – Booth 2353, W2
March 14-16, 2017
Shanghai New International Expo Centre
Shanghai, China
SEMICON Korea – Booth 5728, Hall D
February 8-10, 2017
COEX
Seoul, Korea
SEMICON Japan – Presenter
Doug Suerich, Product Evangelist
“Leveraging SEMI standards to enable Smart Manufacturing in existing facilities”
TechSPOT WEST Exhibitor Presentations
Date: Wednesday, December 14
Time: 15:00
Abstract
The emerging IoT market is driving the growth of 200mm fabs which have traditionally not embraced the level of automation found in 300mm manufacturing facilities. However, as the demand for low-cost devices increases, better manufacturing control is becoming a must for all fabs. Emerging Smart Manufacturing technologies hold the promise of providing the flexibility required to respond rapidly and cost-effectively in both high-volume/low-mix and high-volume/high-mix production environments. However, adding such technologies can be challenging to implement in facilities with existing equipment and manufacturing operation systems that do not support easy customizations. This discussion proposes an architecture that leverages existing SEMI standards to retrofit a fab with the latest big data and analysis capabilities but without impacting existing equipment and operations.
SEMICON Japan – Booth 3205, Hall 3
14-16 December 2016
At SEMICON Japan, we co-exhibit with our Japanese distributor, Mizuho Information & Research
Tokyo Big Sight
Tokyo, Japan
electronica
8-11 November 2016
Messe München
Munich, Germany
North America SEMI Standards Fall 2016 Meetings
7-10 November 2016
PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.
San Jose, CA
USA
SEMICON Europa – Presenter
26 October 2016
Doug Suerich, Product Evangelist
“Turning Data into Action: The Importance of On-Tool Data Brokers for Enabling Big Data Analytics and Increasing Fab Productivity”
TechLOUNGE Session 2: Fab Productivity and Smart Manufacturing
Wednesday, October 26, 2016
12:00
Abstract
In today’s connected world, Smart Manufacturing initiatives make it possible for semiconductor device makers to leverage data, gain insights into their processes, and make manufacturing decisions and processing modifications that will improve fab productivity.
Data collection has always been an essential part of semiconductor manufacturing and now, successful big data solutions enable intelligent analysis and allow manufacturers and suppliers to turn their collected data into action. As the cost of adding more sensors and data sources to equipment continues to become more affordable, it’s important to consider how to broker high volumes of sensitive data at high speeds from disparate sources, how to consolidate the data on a single tool or across multiple tools to enable data analytics, and how to segregate IP and share information securely across business partners.
Interconnecting equipment and process data provides new opportunities to fabs and OEMs to feed efficiency gains back into the manufacturing process.
- OEMs can analyze the data near-tool or even remotely and make equipment adjustments, ensure optimal equipment performance during production, and provide a higher standard of service to the fab through more efficient and cost-effective tool support.
- The fab will benefit from more efficient, autonomous manufacturing as it leverages equipment data to remove production inefficiencies, reduce costs, and improve uptime and yield.
Join us in the TechLOUNGE as we explore the concept of data brokering through a secure pipe to enable a new generation of OEM and fab collaboration, central to Smart Manufacturing.
SEMICON Europa – Booth 362
25-27 October 2016
Alpexpo
Grenoble, France
SEMICON Europa – Session Chair
25 October 2016
Michael Arnold, Managing Director, PEER Group GmbH
Smart & Sustainable Manufacturing Session Chair
TechARENA 1
14:00-16:45
Session agenda: www.semiconeuropa.org/node/3396
APC Conference IMA-APC Council Meeting – Presenter
20 October 2016
Doug Suerich, Product Evangelist
IMA-APC Council Meeting
Hilton Phoenix / Mesa Hotel, Arizona
9am-12pm
Meeting topic: Security of Data and Intellectual Property in Fabs: Challenges and Potential Solutions
Meeting agenda: www.cvent.com/events/apc-conference-xxviii-2016
APC Conference XXVIII 2016
17-20 October 2016
Hilton Phoenix / Mesa Hotel
Mesa, Arizona
USA
European MEMS Summit 2016
15-16 September 2016
Maritim Hotel Stuttgart
Stuttgart, Germany
SEMICON Taiwan
7-9 September 2016
Taipei Nangang Exhibition Center
Taipei, Taiwan
SEMI Standards Meetings
12-14 July 2016
PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.
Moscone Center
San Francisco, USA
SEMICON West – Booth 1239, South Hall
12-14 July 2016
Moscone Center
San Francisco, USA
ASMC 2016
16-19 May 2016
Saratoga Springs, USA
North America SEMI Standards Spring 2016 Meetings
4-7 April 2016
PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.
San Jose, CA
USA
SEMICON China
15-17 March 2016
Shanghai New International Expo Centre
Shanghai, China
SEMICON Korea – Booth 5728, Hall D
27-29 January 2016
At SEMICON Korea, we co-exhibit with our Korean distributor, ELIM Technology
COEX
Seoul, Korea
SEMICON Japan – Booth 2304, Hall 2
16-18 December 2015
Location:
Tokyo Big Sight
Tokyo, Japan
Visit us and our Japanese distributor, Mizuho Information and Research Institute, in Booth 2304, Hall 2.
SEMICON Europa – Booth 1242
6-8 October 2015
Location:
Messe Dresden
Dresden, Germany
Visit us in Booth 1242
SEMICON Europa – Industry 4.0 Session Chair Michael Arnold
Location:
TechARENA 2, MESSE Dresden
Dresden, Germany
Session and Time:
Industry 4.0 Session
Chair / Moderator: Dr. Michael Arnold, Managing Director, PEER Group GmbH
6 October 2015
13:30-17:00
SEMICON Taiwan
2-4 September 2015
Location:
TWTC Nangang Exhibition Hall
Taiwan
SEMICON West – Booth 1922, South Hall
14-16 July 2015
Location:
Moscone Center
San Francisco, USA
APC|M Europe Conference – Presenters
13-15 April 2015
Location:
Freising, Germany
PEER Group Speaker and Topic:
Roland Willmann
Presentation: “Transition of high automation manufacturing to Semantic Web Technologies”
Tuesday, April 14th
Abstract:
The presentation provides an insight to Semantic Web Technologies and how they support requirements which are discussed in the context of the Industry 4.0. initiative. The focus is twofold: on opportunities where Semantic Web Technology can be applied during a standardization process, and on a development path towards the application of Semantic Web Technology in a high-automation factory.
SEMICON China
17-19 March 2015
Location:
Shanghai New International Expo Centre
Shanghai, China
Trade Mission to South Korea – Delegate
8-11 February 2015
Location:
Seoul, South Korea
Bill Schmalz joins Canada’s Minister of International Trade, The Honorable Ed Fast, and other Canadian delegates on this trade mission.
SEMICON Korea – Booth 5750, Hall D
4-6 February 2015
Location:
COEX
Seoul, Korea
February 4-6, 2015
Visit us in Hall D, Booth 5750
SEMICON Japan
3-5 December 2014
Location:
Tokyo Big Sight
Tokyo, Japan
Visit PEER Group at Mizuho Information and Research Institute Inc.’s booth at: Hall 2, Booth 2007
SME Support Japan New Value Creation Exhibition 2014 – Presenter
20 November 2014
Location:
Tokyo Big Sight
Tokyo, Japan
PEER Group Speaker and Topic:
Dr. Michael Arnold – Managing Director, PEER Group GmbH
“Industry 4.0: An IT Solutions Company’s Perspective”
The German initiative Industry 4.0 shall strengthen the country’s position as one of the leading industry regions and suppliers of factories by leveraging IT solutions for creating something revolutionary. The implementation, however, will take into account the business reality of existing and new factories and their equipment suppliers. Several elements of this process are discussed from the perspective and the experience of an IT solutions provider.
SEMICON Europa – Presenter
7-9 October 2014
Location:
Alpexpo
Grenoble, France
Visit us in Booth 261
PEER Group Speaker and Topic:
William Schmalz – Director, Global OEM Sales
“An Agile Approach to Automation Software for Tool Control”
Location:
TechARENA 1
October 7, 2014
Time: 16:10
Abstract:
As fabs strive for more productive manufacturing processes, OEMs are forced to become more agile in the deployment of their tools. In the old paradigm of tool automation and control development, this requirement for agility causes tension between cost-effective tool development and long-term maintainability. We are presenting our suite of off-the-shelf tool automation development products architected specifically for the semiconductor tool maker to enable agility and cost-effective maintainability. Using our products, OEMs can meet the fab’s needs for productive manufacturing, while reducing turnaround times, time to market, and cost of ownership. Learn how PEER Group’s product team has designed our OEM product suite to help tool builders become more agile and cost effective at developing and supporting next-generation tool development.
SEMICON Taiwan
3-5 September 2014
Location:
TWTC Nangang Exhibition Hall
Taiwan
SEMICON West
8-10 July 201
Location:
Moscone Center
San Francisco, USA
Visit us in South Hall, Booth 1622
APC|M Europe Conference – Presenter
7-9 April 2014
Location:
Rome, Italy
PEER Group Speaker and Topic:
Roland Willmann
“Fast Machine Ramp-up Through a Comprehensive Equipment Automation Platform”
Roland will talk about an innovative multilayer software architecture for equipment automation purposes. This architecture enables flexible and reusable abstraction of production equipment in order to improve collected data quality, ensure fast integration of new clustered production machines into the factories IT-landscape and therefore to save significant time during capacity ramp-up of your production. Typical cases are discussed as well.
SEMICON China
18-20 March 2014
Location:
Shanghai New International Expo Centre
Shanghai, China
SEMICON Korea
12-14 February 2014
Location:
COEX
Seoul, Korea
Visit us in Hall B, Booth 4205
SEMICON Japan
4-6 December 2013
Location:
Makuhari Messe
Chiba, Japan
Visit PEER Group at Mizuho Information and Research Institute Inc.’s booth at: Hall 5, Booth 5B-404
SEMICON Europa
8-10 October 2013
Location:
Messe Dresden
Dresden, Germany
Hall 1, Booth 1660
SEMICON West
9-11 July 2013
Location:
Moscone Center
San Francisco, CA
South Hall, Booth 1647
SEMICON China
19-21 March 2013
Location:
Shanghai New International Expo Centre
Shanghai, China
View our joint automation and control solution with MKS Instruments in Booth 3461
SEMICON Korea
31 January – 1 February 2013
Location:
COEX
Seoul, Korea
SEMICON Japan
5-7 December 2012
Location:
Makuhari Messe
Japan
Hall 5, Booth 5B-404
SEMICON Europa
9-11 October 2012
Messe Dresden
Dresden, Germany
PEER Group and Owens Design seminar: Building Software Flexibility and Reliability into Automated Systems
27 September 2012
47427 Fremont Blvd.
Fremont, California
USA
Seminar Program Details
SEMICON West
10-12 July 2012
Location:
Moscone Center
San Francisco, CA
South Hall, Booth 1643
SEMICON Japan
7-9 December 2011
Location:
Makuhari Messe,
Chiba, Japan
SEMICON Europa
11-13 October 2011
Location:
Messe Dresden,
Germany
Hall 1, Booth 1.035
Workshop Process Optimization, Continuous Improvement and Intelligent Process Control in the Daily Manufacturing Practice
25 September 2011
A joint workshop presented by GE Intelligent Platforms Europe S.A. and PEER Group GmbH.
Location:
Dresden, Germany
Today’s typical manufacturing processes are characterized by a high complexity governed by multidimensional cause-effect networks, the exploration of which can be a challenging endeavor. Nevertheless, root causes for process excursions and disturbances of the manufacturing process have to be identified and corrected for within the shortest timeframe possible. To do this successfully will require monitoring and control mechanisms of considerably higher performance and intelligence.
With Proficy Troubleshooter and Proficy Cause+ our workshop introduces solutions of GE IP (General Electric / Intelligent Platforms), which enable process and manufacturing experts, automation and control engineers as well as maintenance specialists and teams to achieve faster process analysis, improved monitoring and optimized process control within a unified open framework. Besides talks which highlight several aspects of the functionality of Proficy Troubleshooter and Proficy Cause+, we will demonstrate the capabilities for analysis, optimization and improved process control using the example of a concurrent flow drying process.
Workshop Prozessoptimierung, kontinuierliche Verbesserung und intelligente Prozessführung in der betrieblichen Praxis
Donnerstag, 15. September 2011 in Dresden
Heutige Fertigungsprozesse sind geprägt durch eine typischerweise hohe Komplexität mit nicht einfach verstehbaren, vieldimensionalen Ursache-Wirkungs-Gefügen. Dennoch sind Ursachen für Abweichungen vom Sollverhalten und von Störungen des Prozesses in kürzester Zeit zu ermitteln und nachhaltig zu beseitigen. Dies gelingt nur durch eine wesentlich höhere Leistungsfähigkeit und Intelligenz der eingesetzten Regelungs- und Überwachungsverfahren.
Unser Workshop stellt mit den Produkten Proficy Troubleshooter und Proficy Cause+ Lösungen von GE-IP (General Electric / Intelligent Platforms) vor, die es unter anderem Prozess- und Anlagenspezialisten, Automatisierungsfachleuten und Wartungs- und Instandhaltungsteams ermöglichen, die Zielstellungen einer schnelleren Problemanalyse, verbesserten Überwachung und optimierten Prozessregelung in einem einheitlichen und offenen Framework zu erreichen. Neben Vorträgen, die die Funktionalität von Proficy Troubleshooter und Proficy Cause+ beleuchten, demonstrieren wir Ihnen die Möglichkeiten zur Analyse, Optimierung und verbesserten Regelung Ihrer Prozesse und Verfahren am praktischen Beispiel eines Gleichstrom-Trockenprozesses.
SEMICON West
12-14 July 2011
Location:
San Francisco, CA
July 12-14, 2011
South Hall, Booth 419
AEC/APC Symposium Presentation
Title: The Importance of EEQA Common Component Template Definitions
Author(s): Mike Thiessen, Gino Crispieri
Affiliation: PEER Group, International SEMATECH Manufacturing Initiative (ISMI)
Presenter: Mike Thiessen
Abstract
Enhanced Equipment Quality Assurance (EEQA) is the foundation of collaborative activities to lower cost and improve equipment availability in the semiconductor industry. Based on six important Equipment Engineering System (EES) guidelines that promote the definition, availability, and sharing of EES data, EEQA is the core activity that enables the OEM and IC maker to improve and increase equipment efficiency and reliability during its lifecycle.
EEQA requires the OEM to make functional equipment data available by specifying parametric data as defined by the EEQA Common Component Templates. These templates focus on the functions, events, and data parameters of the equipment’s main components that the supplier and/or IC maker identifies are critical when monitoring the overall equipment’s function and its components’ performance to ensure process reliability. EEQA Common Component Templates are also used by IC makers to confirm that the equipment functions as the OEM intended and to facilitate the visualization and analysis of the data. Once data is made available by the OEM, both the OEM and IC maker can use the data to visualize, determine, and understand the equipment’s behavior and monitor and improve its functional performance. EEQA data helps track and improve the equipment’s reliability and efficiency.
This presentation describes a collaborative effort between PEER Group and ISMI to identify common component data and events for equipment and highlights the importance of data that is not currently defined in any existing SEMI standard. Practical examples will focus on how this data can be managed on the tool and communicated to the IC maker. Additionally, the benefits of using this data for tool acceptance benchmarks will be analysed.