Events

Messe München | Munich, Germany

Tokyo Big Sight | Tokyo, Japan

Moscone Center | San Francisco, USA

Encore Boston Harbor | Boston, USA

We’re excited to attend the 59th International Symposium on Microelectronics, taking place September 28 – October 1, in Boston.

Bob Kane, PEER Group’s Director of North American Sales and a proud Bostonian, is looking forward to connecting with fellow attendees and discussing the latest innovations in semiconductor manufacturing and advanced packaging.

Organized by International Microelectronics Assembly and Packaging Society (IMAPS), the IMAPS Symposium will feature keynotes from leading thinkers at Qualcomm, Cerebras Systems, IBM, and Marvell.

Did you know the latest version of PTO, our flagship equipment automation product, includes a range of features developed specifically for advanced packaging, including the ability to map substrates with up to 100,000 dies?! To learn more, visit the PTO page.

Albany NanoTech Complex | Albany, USA

The dynamic duo of Bob Kane and Ryan Daniel is headed to the SEMI Northeast Fall Forum tomorrow in Albany, NY.

Bob and Ryan look forward to touring the Albany Nanotech Complex, connecting with industry peers, and exploring how AI, advanced packaging, and next-gen computing are transforming semiconductor manufacturing.

See you there!

TaiNEX | Taipei, Taiwan

Northrop Grumman | Linthicum, Maryland

Ryan Daniel is attending the SEMI Fab Owners Alliance (FOA) meeting at Northrop Grumman’s 88,000 sq. ft. manufacturing facility in Linthicum, MD.

For more than 15 years, the FOA has brought together semiconductor fabs and suppliers to discuss common manufacturing issues, combining strengths and resources to improve overall efficiency and stay competitive.

Don’t miss Ryan’s presentation, Smart Mfg. WG: Automation Maturity Readout, on July 30 at 4:45 p.m. Ryan will provide an update on the work being done by SEMI’s Smart Manufacturing Automation Working Group, including efforts to advance automation across semiconductor manufacturing.

See you there!

Presenter:

Hilton Dresden | Dresden, Germany

Catch up with Torsten Werneke at SEMI 3D & Systems Summit, happening in Dresden from June 17-19.

3D & Systems Summit brings together semiconductor packaging leaders to explore the strategies and technologies driving next-generation heterogeneous systems integration.

Torsten will be onsite attending many of the expert-led workshops and networking sessions. Connect with him to learn how PEER Group’s smart automation solutions are enabling tool and fab intelligence.

Dresden Airport | Dresden, Germany

Join us at Silicon Days 2026!

Portland, USA

Developed in partnership with Canada’s Semiconductor Council and Innovation, Science and Economic Development Canada (ISED) and co-organized by the Consulate General of Canada in Seattle, Business Oregon, and The Technology Association of Oregon, the 2026 Canadian Semicon Business Delegation to Oregon will comprise a group of leading Canadian semiconductor companies with export ties to the United States. Participants will gain an in-depth understanding of the Oregon semiconductor ecosystem with visits to several critical sites.

PEER Group is proud to be part of the delegation.

To learn more, visit: 2026 Canadian Semicon Trade Mission to Oregon’s Silicon Forest – Tradecommissioner.gc.ca

Portland Marriott Downtown Waterfront | Portland, USA

Bob Kane, PEER Group’s Director, North American Sales, is pleased to attend the 40th edition of the CS MANTECH conference. Connect with Bob Kane to discuss our range of equipment and factory automation and connectivity products and services.

Hilton Albany | Albany, USA

The ASMC is an annual technical conference that brings together manufacturers, equipment and materials suppliers, and academia working in the semiconductor industry to solve manufacturing challenges with innovative strategies and methodologies.

PEER Group will have a strong presence at this year’s event. Director of Marketing, Doug Suerich, will be serving as Track Chair for the Smart Manufacturing sessions. Albert Fuchigami, PEER Group’s Senior Standards Specialist is lending his expertise during the SEMI Standards Spring Meetings, while Bob Kane, Director of North American Sales and Ryan Daniel, Sales Engineer, Factory Sales, will be attending various sessions and networking events.

MITEC | Kuala Lumpur, Malaysia

PEER Group Channel Manager for Asia, Atharva (AT) Phadnis, is looking forward to meeting semiconductor OEMs and fabs during SEMICON Southeast Asia. Connect with AT Phadnis to learn about our range of automation and connectivity products and services.

Four Points by Sheraton | Catania, Italy

SNIEC | Shanghai, China

PEER Group Channel Manager for Asia, Atharva (AT) Phadnis, is attending SEMICON China along with Christy Liu of Long Golden Technology Co., Ltd., PEER Group’s distributor in China.

Connect with AT Phadnis and Christy during the show to discuss our SEMI Standards-compliant factory automation, connectivity, and test products and services.

Nürnberg, Germany

PEER Group’s Director of Marketing, Doug Suerich, is presenting during a workshop hosted by the Bavarian Chips Alliance of Bayern Innovativ GmbH.

Presented in collaboration with Swansea University and SEMI, the interactive workshop will cover topics and strategies for strengthening cybersecurity throughout the semiconductor industry supply chain.

Focus will be on how the Semiconductor Manufacturing Cybersecurity Consortium (SMCC) and its Standardized Semiconductor Cyber Assessment (SSCA) framework improves supply chain security assurance.

Learn more here.

Sheraton Grand at Wild Horse Pass | Phoenix, USA

Bob Kane, PEER Group’s Director, North American Sales, will be at the International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference 2026 this week in Phoenix, AZ.

Featuring a great lineup of keynote speakers, panels, technical sessions, and courses, DPC2026 is the perfect event to learn about the latest trends and innovations in advanced packaging.

Bob looks forward to connecting with both equipment suppliers and fabs to discuss how automation and connectivity requirements in the backend are evolving to keep up with the growing complexity and importance that advanced packaging has in our industry.

To understand more about these changes and potential impacts they will have on manufacturing equipment, read our tech brief on Advancing the Backend.

Austin, USA

PEER Group’s Ryan Daniel is headed to Austin, TX for the SEMI Fab Owners Alliance (FOA) Summit (Q1 Collaborative Forum).

Connect with Ryan during the event to learn about PEER Group’s semiconductor fab automation, connectivity, and test products and services. Be sure to ask him how Polar Semiconductor is using PEER FACTORY Station Controller (PFSC) to help modernize operations and reduce equipment interface development and tool integration time by 30%!

Learn more by reading the customer story.

COEX | Seoul, South Korea