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Advancing the Backend

SEMI Standards are coming to the backend. Is your equipment ready?

We presented on standardizing the backend in a webinar on June 22, 2023. Click here to request the webinar recording.

SEMI® Standards adoption is widespread in the frontend while backend manufacturing remains largely unregulated. As advanced packaging – a backend process of growing importance – becomes more complex and sophisticated, backend factories are requesting that OEMs support certain SEMI Standards as part of the factory spec. By requiring standards such as SECS/GEM, GEM300, and EDA, backend fabs hope to reap the same benefits that standardization has brought to the frontend, like reduced tool integration time, increased automation and data collection, and optimized throughput and yield.

These requirements introduce a new set of challenges for OEMs that may have limited experience complying with SEMI Standards. What’s more, the variability of advanced packaging components and processes increases automation and connectivity challenges, especially when adhering to a strict set of standards and factory requirements.

Why advanced packaging is such a challenge

Compared to the more mature frontend, advanced packaging consists of a wide variety of processes and components. Some of the challenges include:

  • Tool variation: Equipment types used in advanced packaging include lithography, deposition, dicing, stacking, bonding, test, and inspection and metrology tools, among others. The high variance of tool types is a big barrier to automation.
  • Product variation: Advanced packaging employs a wide variety of die sizes, interconnect methods, substrates, and manufacturing requirements, all of which raise the complexity associated with tool integration, automation, and process control when compared to a wafer-centric frontend.
  • Material handling: Containers used to transfer product between tools can include carriers, trays, tapes and reels as material makes its way through backend processes. Compare this to the frontend, when most material is transferred in standardized FOUPs.
  • Limited standards knowledge: Not many tool suppliers know or understand SEMI Standards enough to efficiently implement them.

SEMI Standards

Established in 1973, the SEMI International Standards Program oversees the development of essential technical specifications which serves as the guiding principles of high yield semiconductor manufacturing. The E Series of Standards deals with equipment automation and data compatibility.

SEMI Standards used in advanced packaging:

Get ready

Despite the challenges, there are steps OEMs can take to make sure they are best prepared for when SEMI Standards and advanced automation and connectivity requirements are listed in the factory spec. They include:

Understand the factory spec

Sometimes called the purchase spec, this document contains all specifications and technical requirements equipment needs to meet to pass factory acceptance. OEMs must understand what they are committing too when agreeing to the spec. Delivering on the factory spec not only ensures full payment, but it also improves the chances of becoming a trusted, long-term supplier.

Test and validate before shipping

Shipping non-compliant tools that fail to qualify can ruin an OEM’s reputation with fabs. Testing and validating the tool in-house before it arrives on the factory floor ensures quick factory integration. There are several test applications available to OEMs to validate their tool against SEMI Standards, automation compliance, protocol testing, and scenario testing. With proper testing and know-how, tools can be compliant and ready to start production immediately upon delivery to the factory floor.

Become knowledgeable on SEMI Standards

There are more than 1,000 SEMI Standards. Fortunately, you’ll never need to know them all. That said, OEMs should be familiar with the SEMI Standards that are applicable to their tool and processes and understand how to comply with them. Having access to a resource who keeps current and knowledgeable on the latest SEMI Standard developments and how to properly interpret and apply them can be an invaluable asset.

Join a SEMI Task Force

SEMI Task Forces are responsible for the development effort of new standards and addressing needs in existing ones. By participating, members play an integral role in deciding how and what standards should be adopted. In terms of advanced packaging specifically, OEMs interested in having a say should consider joining the Advanced Backend Factory Integration Task Force (ABFI).

PEER Group can help

PEER Group supplies all types of semiconductor tool manufacturers with SEMI Standards compliant connectivity and automation software along with the expertise needed to get their equipment accepted and integrated into factories. A big part of the work we do for customers is making sure their tools comply with various automation SEMI Standards.

Discover how we can help solve your automation compliance challenges

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